Resonant compensating loop for shielding of metal for magnetically coupled NFC and/or RFID devices, and methods of making and using the same
First Claim
1. A near field communication device, comprising:
- a) a receiver configured to convert a first near field signal to an electric signal;
b) a transmitter configured to generate a second near field signal;
c) a dielectric substrate within a housing;
d) an antenna on or over said dielectric substrate, said antenna receiving said first near field signal, transmitting or broadcasting said second near field signal, and generating a flux;
e) an insulating or dielectric layer on or over said antenna; and
f) a resonant compensating loop within said housing and coupled to said antenna, said resonant compensating loop (i) being on an opposite side of said insulating or dielectric layer from said antenna and (ii) having at least two turns or loops, wherein a current in the resonant compensating loop has a direction that aids the flux generated by the antenna.
2 Assignments
0 Petitions
Accused Products
Abstract
A near field communication device, and methods of manufacturing and using the same. The near field communication device includes a receiver configured to convert a received near field signal to an electric signal, a transmitter configured to generate a transmittable near field signal, a dielectric substrate within a housing, an antenna on the dielectric substrate, and a compensating loop within the housing and coupled to the antenna. The antenna is configured to receive the received near field signal and to transmit or broadcast the transmittable near field signal. The compensating loop is electromagnetically coupled to the antenna and advantageously mitigates or counteracts an electromagnetic effect of metal on or near a surface of the dielectric substrate opposite from the antenna.
8 Citations
31 Claims
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1. A near field communication device, comprising:
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a) a receiver configured to convert a first near field signal to an electric signal; b) a transmitter configured to generate a second near field signal; c) a dielectric substrate within a housing; d) an antenna on or over said dielectric substrate, said antenna receiving said first near field signal, transmitting or broadcasting said second near field signal, and generating a flux; e) an insulating or dielectric layer on or over said antenna; and f) a resonant compensating loop within said housing and coupled to said antenna, said resonant compensating loop (i) being on an opposite side of said insulating or dielectric layer from said antenna and (ii) having at least two turns or loops, wherein a current in the resonant compensating loop has a direction that aids the flux generated by the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a near field communication device, comprising:
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a) forming an antenna on a dielectric substrate or on an insulating or dielectric layer, said antenna receiving a first near field signal and transmitting or broadcasting a second near field signal, and coupled to a receiver and a transmitter, said antenna generating a flux; b) forming a resonant compensating loop configured to be electromagnetically coupled to said antenna, that mitigates or counteracts an electromagnetic effect of metal on or near a surface of said dielectric substrate, said resonant compensating loop having at least two turns or loops, wherein a current in the resonant compensating loop has a direction that aids the flux generated by the antenna; and c) placing and/or forming said antenna, said dielectric substrate, said insulating or dielectric layer, and said compensating loop in a housing of the near field communication device such that said resonant compensating loop is on an opposite side of said insulating or dielectric layer from said antenna. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method of monitoring at least one parameter of a semiconductor manufacturing process, comprising:
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a) conducting the semiconductor manufacturing process; b) monitoring one or more physical parameters of the semiconductor process; and c) transmitting data or information from a monitor configured to monitor the semiconductor process, and reading the data or information with a reader configured to receive the data or information from the monitor, wherein the monitor and/or reader comprises a near field communication device comprising; a receiver configured to convert a first near field signal to an electric signal; a transmitter configured to generate a second near field signal; a dielectric substrate within a housing; an antenna on said dielectric substrate, said antenna receiving said first near field signal and transmitting or broadcasting said second near field signal; and a compensating loop within said housing and coupled to said antenna. - View Dependent Claims (28, 29)
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30. A method of manufacturing a near field communication device, comprising:
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a) forming an antenna on a dielectric substrate, said antenna receiving a first near field signal and transmitting or broadcasting a second near field signal, and coupled to a receiver and a transmitter; and b) forming a compensating loop configured to be electromagnetically coupled to said antenna and that mitigates or counteracts an electromagnetic effect of metal on or near a surface of said dielectric substrate by a process that comprises (i) depositing a first metal layer on or over said dielectric substrate, then patterning and etching said first metal layer, or (ii) printing a metal coil or ring on said dielectric substrate; wherein said dielectric layer is formed on said compensating loop before said antenna is formed, and said antenna, said dielectric substrate and said compensating loop are formed or placed in a housing of the near field communication device. - View Dependent Claims (31)
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Specification