Semiconductor package including antenna substrate and manufacturing method thereof
First Claim
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1. A semiconductor package comprising:
- a package substrate including an upper surface;
a semiconductor device disposed adjacent to the upper surface of the package substrate;
an antenna substrate directly disposed on the semiconductor device without an intervening layer, the antenna substrate covering the semiconductor device, the antenna substrate including;
a core layer including an upper surface, a lower surface, a lateral surface extending between the upper surface and the lower surface of the core layer, a feeding conductive via and a grounding conductive via;
a grounding layer formed on the lower surface of the core layer; and
an antenna layer formed on the upper surface of the core layer and electrically connected to the grounding layer through the grounding conductive via; and
a package body encapsulating and in contact with the semiconductor device and the entire lateral surface of the core layer of the antenna substrate.
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Abstract
A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate.
104 Citations
20 Claims
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1. A semiconductor package comprising:
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a package substrate including an upper surface; a semiconductor device disposed adjacent to the upper surface of the package substrate; an antenna substrate directly disposed on the semiconductor device without an intervening layer, the antenna substrate covering the semiconductor device, the antenna substrate including; a core layer including an upper surface, a lower surface, a lateral surface extending between the upper surface and the lower surface of the core layer, a feeding conductive via and a grounding conductive via; a grounding layer formed on the lower surface of the core layer; and an antenna layer formed on the upper surface of the core layer and electrically connected to the grounding layer through the grounding conductive via; and a package body encapsulating and in contact with the semiconductor device and the entire lateral surface of the core layer of the antenna substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package comprising:
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a package substrate including an upper surface; a chip disposed adjacent to the upper surface of the package substrate; a wire electrically connecting the chip and the package substrate; a spacer substrate directly disposed on the chip; an antenna substrate directly disposed on the spacer substrate and extending over the chip to cover the chip and comprising; a core layer including an upper surface, a lower surface, a lateral surface extending between the upper surface and the lower surface of the core layer, and a conductive via; a grounding layer formed on the lower surface of the core layer; and an antenna layer formed on the upper surface of the core layer and electrically connected to the grounding layer through the conductive via; and a package body encapsulating and in contact with the chip, the spacer substrate, and the entire lateral surface of the core layer of the antenna substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of making a semiconductor package, comprising:
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providing a package substrate, wherein the package substrate includes an upper surface; disposing a chip on the upper surface of the package substrate; providing an antenna substrate, wherein the antenna substrate is verified to be a working antenna substrate; and
wherein the antenna substrate includesa core layer including an upper surface, a lower surface, a lateral surface extending between the upper surface and the lower surface of the core layer, and a conductive via; a grounding layer formed on the lower surface of the core layer; and an antenna layer formed on the upper surface of the core layer and electrically connected to the grounding layer through the conductive via; disposing the antenna substrate on the chip, a spacing between the antenna substrate and the chip being less than 500 micrometers, the antenna substrate covering the chip; and forming a package body encapsulating and in contact with the chip, a portion of the upper surface of the substrate, and the entire lateral surface of the core layer of the antenna substrate. - View Dependent Claims (20)
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Specification