Method of manufacturing pressure sensor, deposition system, and annealing system

• US 9,853,209 B2
• Filed: 03/18/2015
• Issued: 12/26/2017
• Est. Priority Date: 03/19/2014
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Fuji, Yoshihiko, Fukuzawa, Hideaki, Kaji, Shiori
• Primary Examiner(s): Payen, Marvin
• Assistant Examiner(s): JOY, JEREMY J
• Application Number:
  US14/661,164
• Publication Number:
  US 20150268116A1
• Time in Patent Office: 1,014 Days
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 16/458 characterised by the method used for supporting substrates in the reaction chamber
• CPC Class Codes: G01L 1/125 by using magnetostrictive means magnetostrictive sensors H10N35/101
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/16 by making use of variations in the magnetic properties of material resulting from the application of stress
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H10N 50/01 Manufacture or treatment

Abstract

A method of manufacturing a pressure sensor comprises: above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers on one surface of a substrate; removing the deposited layers leaving a part thereof; and removing a part of the substrate from another surface of the substrate. By removing the deposited layers leaving a part thereof, a strain detecting element is formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer. By removing a part of the substrate, a part of the first region of the substrate is removed. In addition, the deposition of the first magnetic layer is performed with the substrate being bended.

Claims

1. A deposition system comprising:

a substrate holder holding a substrate; and

a deposition portion performing deposition on the substrate held by the substrate holder,

the substrate holder comprising a support mechanism and a holding mechanism, the substrate holder holding the substrate between the support mechanism and the holding mechanism,

the support mechanism comprising a first movable support member and a second movable support member which are arranged in a first direction, the first movable support member and the second movable support member extending in a second direction crossing the first direction,

the holding mechanism comprising a first movable holding member and a second movable holding member arranged in the first direction, and

the first movable support member, the second movable support member, the first movable holding member and the second movable holding member being movable in a third direction crossing the first and the second directions.

2. The deposition system according to claim 1, wherein

the first movable support member and the second movable support member have first surfaces facing the substrate, the first surface has a curved surface or a knife edge structure formed in an angular shape.

3. A deposition system comprising:

a substrate holder holding a substrate; and

a deposition portion performing deposition on the substrate held by the substrate holder,

the substrate holder comprising,

a support mechanism supporting the substrate, and

a holding mechanism holding the substrate,

the support mechanism comprising a first movable support member and a second movable support member which are arranged in a first direction, the first movable support member and the second movable support member extending in a second direction crossing the first direction,

the first movable support member and the second movable support member being movable in a third direction crossing the first and the second directions,

the first movable support member and the second movable support member having first surfaces facing the substrate, and

the first surface having a curved surface or a knife edge structure formed in an angular shape.

4. The deposition system according to claim 3, wherein

the substrate holder holding the substrate between the support mechanism and the holding mechanism,

the holding mechanism comprises a first movable holding member and a second movable holding member arranged in the first direction, and

the first movable holding member and the second movable holding member are movable in the third direction.

5. The deposition system according to claim 4, wherein

the first movable holding member and the second movable holding member have second surfaces facing the substrate, the second surface has a curved surface or a knife edge structure formed in an angular shape.

6. The deposition system according to claim 3, wherein

the holding mechanism comprises a first electrostatic chuck plate disposed on the first surface of the first movable support member and a second electrostatic chuck plate disposed on the first surface of the second movable support member.

7. The deposition system according to claim 6, wherein

the first electrostatic chuck plate and the second electrostatic chuck plate have third surfaces facing the substrate, the third surface has a curved surface or a knife edge structure formed in an angular shape.

8. A deposition system comprising:

a substrate holder holding a substrate; and

a deposition portion performing deposition on the substrate held by the substrate holder,

the substrate holder comprising,

a support mechanism supporting the substrate, and

a holding mechanism holding the substrate,

the support mechanism comprising a first movable support member and a second movable support member which are arranged in a first direction,

widths of the first movable support member and the second movable support member in a second direction crossing the first direction being larger than widths of the first movable support member and the second movable support member in the first direction, and

the first movable support member and the second movable support member being movable in a third direction crossing the first and the second directions.

9. The deposition system according to claim 8, wherein

the widths of the first movable support member and the second movable support member in the second direction are larger than a width of the substrate in the second direction, and

the widths of the first movable support member and the second movable support member in the first direction are smaller than a width of the substrate in the first direction.

10. The deposition system according to claim 8, wherein

the substrate holder holding the substrate between the support mechanism and the holding mechanism,

the holding mechanism comprises a first movable holding member and a second movable holding member arranged in the first direction, and

the first movable holding member and the second movable holding member are movable in the third direction.

11. The deposition system according to claim 8, wherein

the first movable support member and the second movable support member have first surfaces facing the substrate, and

the holding mechanism comprises a first electrostatic chuck plate disposed on the first surface of the first movable support member and a second electrostatic chuck plate disposed on the first surface of the second movable support member.

12. The deposition system according to claim 11, wherein

the first electrostatic chuck plate is movable together with the first movable support member, and

the second electrostatic chuck plate is movable together with the second movable support member.

13. The deposition system according to claim 12, wherein

positions of the first surfaces of the first movable support member and the second movable support member in the third direction can be different from each other.

14. The deposition system according to claim 12, wherein

the first movable support member and the second movable support member are moveable independently from each other.