Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
First Claim
1. A method of making a semiconductor device, comprising:
- providing a semiconductor die;
providing a plurality of modular interconnect units by providing a core material and forming a plurality of vertical interconnect structures extending through the core material to a surface of the modular interconnect units;
disposing the modular interconnect units and semiconductor die in proximity to each other;
depositing an encapsulant over and around the semiconductor die and modular interconnect units;
removing a first portion of the encapsulant extending to a surface of the semiconductor die while leaving a second portion of the encapsulant over the surface of the modular interconnect units; and
forming an opening through the second portion of the encapsulant extending to the vertical interconnect structures of the modular interconnect units.
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Accused Products
Abstract
A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted over the carrier and around or in a peripheral region around the semiconductor die such that the modular interconnect unit is offset from the back surface of the semiconductor die. An encapsulant is deposited over the carrier, semiconductor die, and modular interconnect unit. A first portion of the encapsulant is removed to expose the semiconductor die and a second portion is removed to expose the modular interconnect unit. The carrier is removed. An interconnect structure is formed over the semiconductor die and modular interconnect unit. The modular interconnect unit includes a vertical interconnect structures or bumps through the semiconductor device. The modular interconnect unit forms part of an interlocking pattern around the semiconductor die.
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Citations
25 Claims
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1. A method of making a semiconductor device, comprising:
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providing a semiconductor die; providing a plurality of modular interconnect units by providing a core material and forming a plurality of vertical interconnect structures extending through the core material to a surface of the modular interconnect units; disposing the modular interconnect units and semiconductor die in proximity to each other; depositing an encapsulant over and around the semiconductor die and modular interconnect units; removing a first portion of the encapsulant extending to a surface of the semiconductor die while leaving a second portion of the encapsulant over the surface of the modular interconnect units; and forming an opening through the second portion of the encapsulant extending to the vertical interconnect structures of the modular interconnect units. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making a semiconductor device, comprising:
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providing a semiconductor die; providing a plurality of modular interconnect units by, (a) providing a core material, (b) forming a plurality of conductive interconnect structures extending through the core material to a surface of the modular interconnect units, and (c) forming a first insulating layer over a first surface of the core material; disposing the modular interconnect units around the semiconductor die; depositing an encapsulant over and around the semiconductor die and modular interconnect units; removing a first portion of the encapsulant while leaving a second portion of the encapsulant over the surface of the modular interconnect units; and forming an opening through the second portion of the encapsulant extending to the conductive interconnect structures of the modular interconnect units. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of making a semiconductor device, comprising:
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providing a semiconductor die; providing a plurality of modular interconnect units by providing a core material and forming a plurality of conductive interconnect structures extending through the core material to a surface of the modular interconnect units; disposing a plurality of modular interconnect units around the semiconductor die, wherein a height of the modular interconnect units is less than a height of the semiconductor die; depositing an encapsulant over and around the semiconductor die and modular interconnect units; and forming an opening through the encapsulant over the modular interconnect units extending to the conductive interconnect structures of the modular interconnect units. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A semiconductor device, comprising:
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a semiconductor die; a modular interconnect unit disposed around the semiconductor die, wherein the modular interconnect unit includes a core material and a plurality of vertical interconnect structures extending through the core material and a height of the modular interconnect unit is less than a height of the semiconductor die; and an encapsulant deposited around the semiconductor die and modular interconnect unit with an opening through the encapsulant over the modular interconnect unit extending to the vertical interconnect structures of the modular interconnect unit. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification