Circuit board assembly and method of manufacturing the same
First Claim
1. A circuit board assembly comprising:
- a circuit board having an area on which electronic components are mounted; and
a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area, whereinthe cover includes, on an inner surface thereof, a suppression portion that suppresses the inner surface from approaching the area when external pressure is applied to the cover, and the suppression portion extends through the circuit board at a central portion of the circuit board.
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Accused Products
Abstract
A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover of a circuit board assembly includes a first cover to cover a first surface of a circuit board and a second cover to cover a second surface of the circuit board. A projection portion projects from an inner surface of the first cover. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly as an insert part, the projection portion suppresses deformation of the first cover and the second cover.
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Citations
7 Claims
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1. A circuit board assembly comprising:
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a circuit board having an area on which electronic components are mounted; and a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area, wherein the cover includes, on an inner surface thereof, a suppression portion that suppresses the inner surface from approaching the area when external pressure is applied to the cover, and the suppression portion extends through the circuit board at a central portion of the circuit board. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a complete circuit board assembly which includes:
- a circuit board having an area on which electronic components are mounted; and
a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area;
an outer structure made of synthetic resin which covers outer faces of the cover,the method comprising; accommodating the cover in a mold as an insert, the cover containing the circuit board; and insert-molding the outer structure on outer faces of the cover that contains the circuit board, wherein a first inner surface of the cover is provided with a suppression portion that projects toward second inner surface of the cover and extends through the circuit board at a central portion of the circuit board, the first and second inner surfaces facing each other via the circuit board; and the suppression portion suppresses the first and second inner surfaces of the cover from being deformed by molding pressure and approaching the circuit board when the outer structure is insert-molded.
- a circuit board having an area on which electronic components are mounted; and
Specification