LED module having a highly reflective carrier

• US 10,586,901 B2
• Filed: 02/07/2013
• Issued: 03/10/2020
• Est. Priority Date: 02/13/2012
• Status: Active Grant

• Current Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Original Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Inventors: Wimmer, Florian, Pachler, Peter, Reitinger, Norbert, Gumhold, Juergen
• Primary Examiner(s): Song, Zheng
• Application Number:
  US14/378,581
• Publication Number:
  US 20150016107A1
• Time in Patent Office: 2,588 Days
• Field of Search: 36224902, 362 84, 257 88, 257 98, 257100
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

An LED module, including a carrier having high reflectivity, wherein a metal layer, preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier. Also disclosed is an LED module, including a carrier having high reflectivity, wherein a metal layer is applied to the carrier, at least one LED chip, and a dam, wherein the metal layer partially covers the surface of the carrier lying under the dam.

Claims

1. An LED module, comprising:

a carrier having a reflectance, having a metallic layer comprising a silver layer or a layer composed of ultrapure aluminum, applied on the carrier,

an oxide layer deposited on the metallic layer,

a lacquer layer is provided above the metallic layer or the oxide layer such that the lacquer layer completely covers the metallic layer,

an LED chip arranged on the lacquer layer, and

a dam above the metallic layer or the oxide layer laterally surrounding the LED chip,

wherein the lacquer layer extends as far as the carrier below the dam and covers a surface of the carrier below the dam such that the lacquer layer is entirely circumferentially within the dam and the lacquer layer is encapsulated by a central filling; and

wherein the LED module is configured in such a way that at least part of light incident on the module, emitted from the LED chip, is reflected by the metal layer.

2. The LED module as claimed in claim 1, wherein the LED chip is mounted on the lacquer layer.

3. The LED module as claimed in claim 1, wherein the metallic layer consists of a bondable surface region and a non-bondable surface regions protected against alteration by a protective oxide or organic layer.

4. The LED module as claimed in claim 1, wherein the metallic layer is additionally protected against alteration by the oxide layer or an organic layer.

5. The LED module as claimed in claim 1, wherein the LED chip is applied on one of the metallic layer, on the lacquer layer, on the oxide layer, or directly on the carrier.

6. The LED module as claimed in claim 1, wherein the lacquer layer has an average thickness of 5 to 250 μ

m.

7. The LED module as claim 1, wherein the metallic layer has a thickness of 30 nm to 8000 nm.

8. The LED module as claimed in claim 1, wherein the carrier comprises a printed circuit board.

9. The LED module as claimed in claim 8, wherein the carrier further comprises a base substrate connected to the printed circuit board by an adhesive.

10. The LED module as claimed in claim 9, wherein the base substrate has a thickness of 0.5 to 5 mm.

11. The LED module as claimed in claim 9, wherein the printed circuit board has at least one cutout in a region in which the LED chips are provided.

12. The LED module as claimed in claim 1, wherein LED chips are mounted within the dam connected in series and structured in strings.

13. The LED module as claimed in claim 12, wherein a string preferably contains 5-26 LED chips.

14. The LED module as claimed in claim 12, wherein the LED chips are set up in 1-15 strings on the LED module.

15. The LED module as claimed in claim 1, wherein the LED module is equipped with from 10 to 370 LED chips, spaced uniformly at a distance from one another.

16. The LED module as claimed in claim 1, further comprising a reflector and an additional substrate.

17. A spotlight or a retrofit LED lamp comprising at least one LED module as claimed in claim 1, further comprising one or more of:

a housing,

a reflector,

a driver circuit,

a sensor system,

a heat sink, and

a lamp base.

18. The LED module as claimed in claim 1, further comprising a printed circuit board arranged partially or fully within the dam.