LED MODULE HAVING A HIGHLY REFLECTIVE CARRIER

• US 20150016107A1
• Filed: 02/07/2013
• Published: 01/15/2015
• Est. Priority Date: 02/13/2012
• Status: Active Grant

• Current Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Original Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Inventors: Pachler, Peter, Wimmer, Florian, Reitinger, Norbert, Gumhold, Juergen
• Granted Patent: US 10,586,901 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

An LED module, including a carrier having high reflectivity, wherein a metal layer, preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier. Also disclosed is an LED module, including a carrier having high reflectivity, wherein a metal layer is applied to the carrier, at least one LED chip, and a dam, wherein the metal layer partially covers the surface of the carrier lying under the dam.

Claims

1. An LED module, comprising:

a carrier having a high reflectance, wherein a metallic layer, preferably a silver layer or a layer composed of ultrapure aluminum, is applied on the carrier.

2. The LED module as claimed in claim 1,

comprising an oxide layer above the metallic layer.

3. The LED module as claimed in claim 1,

wherein a lacquer layer is provided above the metallic layer and, if appropriate, the oxide layer.

4. The LED module as claimed in claim 1,

furthermore an LED chip on the metallic layer, the oxide layer or the lacquer layer.

5. The LED module as claimed in claim 1, wherein the metallic layer consists of a bondable surface or surface that is bondable at least in partial regions, and wherein said surface, in the non-bondable surface regions, is additionally protected against alteration by oxides or organic layer(s).

6. The LED module as claimed in claim 1, wherein the metallic layer is additionally protected against alteration by oxides or organic layer(s).

7. The LED module as claimed in claim 1, which is configured in such a way that at least part of light incident on the module, e.g. from an LED chip that can be fitted on the module, is reflected by the metal layer.

12. The LED module as claimed in claim 1, wherein the lacquer layer has an average thickness of 5 to 250 μ

m, preferably 10 to 100 μ

m, preferably 20 to 50 μ

m.

13. The LED module as claimed in claim 1, wherein the metallic layer has a thickness of 30 nm to 8000 nm, preferably a thickness of 100 nm to 300 nm or 2000 nm to 6000 nm.

14. The LED module as claimed in claim 1, wherein the lacquer layer is positioned on the metallic layer and completely covers the space surrounding by the dam and/or projects as far as the surface of the carrier below the dam, and the carrier exhibits at least one region not covered by the lacquer layer.

15. The LED module as claimed in claim 1, wherein the carrier comprises a printed circuit board and/or a base substrate.

16. The LED module as claimed in claim 1, wherein the printed circuit board and the base substrate are connected with the aid of an additional substrate e.g. by an adhesive-bonding process.

17. The LED module as claimed in claim 15, wherein the base substrate has a thickness of 0.5 to 5 mm, preferably 1-1.5 mm, with further preference 1.5 to 2 mm.

18. The LED module as claimed in claim 16, wherein the printed circuit board preferably has at least one cutout in a region in which the LED chips are provided.

19. The LED module as claimed in claim 1, wherein mid- and/or low-power LED chips are mounted within a dam in a manner connected in series and structured in strings.

20. The LED module as claimed in claim 19, wherein a string preferably contains 5-26 LED chips, more preferably 8-20 LED chips, particularly preferably 10-15 LED chips.

21. The LED module as claimed in claim 19, wherein the LED chips are preferably set up in 1-15 strings, more preferably in 3-12 strings on the LED module.

22. The LED module as claimed in claim 1, wherein the LED module is preferably equipped with from 10 to 370 LED chips, particularly preferably with from 20 to 120 LED chips, uniformly at a small distance from one another.

23. The LED module as claimed in claim 1, furthermore comprising a reflector and an additional substrate.

24. The LED module as claimed in claim 1,

wherein the dam laterally surrounds the LED chip or a plurality of LED chips and preferably in terms of height projects beyond the LED chips, which is at least partly applied on the metallic layer and/or the lacquer layer, and

preferably furthermore a central filling composed of a matrix material, preferably a transparent and preferably liquid and thermally curable polymer or a polymer mixture, wherein the central filling preferably completely fills the space surrounding by the dam, such that the top side of the LED chip is coated.

25. The LED module as claimed in claim 24, wherein the central filling comprises color conversion particles and/or scattering particles.

26. The LED module as claimed in claim 24, wherein the material of the dam and the material of the central filling are of the same material class, preferably on the basis of silicone, particularly preferably the dam and the central filling are produced from a polymer or resin with the same structure, thereby enabling the dam and the filling both to be cured in one curing step.

27. The LED module as claimed in claim 24, wherein the material of the dam comprises fillers in the form of particulate material such as e.g. silicon dioxide.

28. The LED module as claimed in claim 24, wherein at least the inner wall of the dam is light-reflecting or scattering, and/or the dam comprises reflective or light-scattering particles, preferably white pigments.

29. The LED module as claimed in claim 24, wherein the dam is a prefabricated element, preferably composed of a polymer, ceramic, metal or plastic.

30. The LED module as claimed in claim 24, wherein the dam has a height of 0.1 to 3 mm, preferably of 0.25 to 2 mm, particularly preferably of 0.5 mm to 0.8 mm, and

wherein the diameter of the cross-sectional area of the dam, that is to say the average thickness of the dam or the maximum distance between the inner wall and the outer wall of the dam, preferably substantially corresponds to the height of the dam.

31. The LED module as claimed in claim 24, wherein the dam in plan view, that is to say as seen perpendicularly to the carrier, has a circular, ellipsoidal, oval or angular shape, for example a rectangular or square or polygonal shape.

32. A spotlight or a retrofit LED lamp comprising at least one LED module as claimed in claim 1, preferably furthermore comprising one or more of:

a housing,

a reflector,

a driver circuit,

a sensor system,

a heat sink and/or

a lamp base an led.

8. An LED module, comprising:

a carrier having a high reflectances, wherein a metallic layer, preferably a silver layer or a layer composed of ultrapure aluminum, is applied on the carrier,

an oxide layer above the metallic layer,

wherein a lacquer layer is provided above the metallic layer and, if appropriate, the oxide layer,

furthermore optionally an LED chip on the metallic layer, the oxide layer or the lacquer layer,

wherein the LED module is configured in such a way that at least part of light incident on the module, e.g. from an LED chip that can be fitted on the module, is reflected by the metal layer.

10. The LED module as claimed in claim 8, furthermore comprising a lacquer layer, wherein the lacquer layer is partly applied on the metallic layer.

11. The LED module as claimed in claim 8, wherein the LED chip is applied on the metallic layer and/or on the lacquer layer and/or directly on the carrier.

9. An LED module, comprising:

a carrier having a high reflectances, wherein a metallic layer is applied on the carrier,

at least one LED chip, and

a dam,

wherein the metallic layer partly covers the surface of the carrier that lies below the dam.

33. An LED module having a carrier having a high reflectance, wherein the LED module is producible by a method comprising the following steps:

applying a metallic layer to a carrier,

applying a ceramic lacquer to the carrier in such a way that the metallic layer of the carrier is partly covered by a lacquer layer,

positioning at least one LED chip on the carrier, the metallic layer or the lacquer layer.

34. The LED module as claimed in claim 33, wherein the method furthermore comprises the following steps:

applying a dam at least partly on the metallic layer and/or the lacquer layer in such a way that the dam laterally surrounds the at least one LED chip,

filling the space surrounding by the dam with a filling material, wherein the central filling that arises in this way is preferably provided in such a way that it coats the top side of the LED chip,

wherein the dam and the central filling are preferably produced from a liquid polymer or a polymer mixture which is cured after the applying and filling, respectively, and

wherein the curing of the dam and the curing of the central filling are carried out after the respective steps or providing the dam and the central filling, or in an individual step after providing the dam and the central filling, wherein in the latter case a chemically and/or physically bonded interface is preferably produced between the dam and the central filling.

35. The LED module as claimed in claim 33, wherein the method furthermore comprises the steps wherein a plurality of steps for applying the ceramic lacquer to the metallic layer are provided, such that the layer thickness of the lacquer layer is increased.

36. The LED module as claimed in claim 33, wherein the method furthermore comprises the steps wherein the ceramic lacquer is printed onto the metallic layer, preferably by means of a screen printing method or a dispensing method.

37. The LED module as claimed in claim 33, wherein the method furthermore comprises the steps wherein the ceramic lacquer is applied to the metallic layer in such a way that the latter is only partially covered by the lacquer layer and has clearances,

wherein the LED chip is adhesively bonded onto the metallic layer preferably in the clearances of the lacquer layer preferably using a reflective, particularly preferably white, adhesive, and

wherein the metering of the adhesive is preferably chosen in such a way that when the LED chip is positioned onto the adhesive in the clearances, the adhesive is laterally displaced in such a way that it at least partly or completely fills the remaining gap between the side wall of the LED chip and an edge boundary of the ceramic lacquer layer facing the LED chip, such that the metallic layer is completely covered in the last-mentioned case.