Preparation of high conductivity copper films

  • US 10,954,406 B2
  • Filed: 02/02/2016
  • Issued: 03/23/2021
  • Est. Priority Date: 06/11/2015
  • Status: Active Grant
First Claim
Patent Images

1. A copper precursor composition comprising:

  • a first copper complex comprising an imine or a first cyclic amine coordinated to a first copper precursor compound,the imine comprising a compound of Formula (I)

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