Circuit device and method of manufacturing the same
First Claim
Patent Images
1. A circuit device comprising:
- a plurality of conductive paths that are electrically isolated;
a circuit element having a front electrode fixed on a desired conductive path;
a metal connecting plate for connecting a back electrode of said circuit element with a desired conductive path; and
an insulating resin for covering said circuit element and integrally supporting said conductive paths.
5 Assignments
0 Petitions
Accused Products
Abstract
After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.
33 Citations
25 Claims
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1. A circuit device comprising:
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a plurality of conductive paths that are electrically isolated;
a circuit element having a front electrode fixed on a desired conductive path;
a metal connecting plate for connecting a back electrode of said circuit element with a desired conductive path; and
an insulating resin for covering said circuit element and integrally supporting said conductive paths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 24)
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10. A method of manufacturing the circuit devices comprising the steps of:
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forming the conductive paths in such a way as to prepare a conductive foil, and to form a trench shallower than the thickness of said conductive foil in said conductive foil except for at least an area that becomes a conductive path;
fixing a front electrode of a circuit element on a desired conductive path;
connecting a back electrode of said circuit element with a desired conductive path via a metal connecting plate;
molding an insulating resin to cover said circuit element and be filled in said trench; and
removing said conductive foil in a thick portion where said trench is not provided. - View Dependent Claims (16, 18, 20, 21, 22, 25)
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11. A method for manufacturing the circuit devices comprising the steps of:
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preparing a conductive foil and forming a corrosion resistant conductive film in at least an area that becomes a conductive path on the surface of said conductive foil;
forming the conductive paths in such a way as to form a trench shallower than the thickness of said conductive foil in said conductive foil except for at least an area which becomes a conductive path;
fixing a front electrode of a circuit element on a desired conductive path;
connecting a back electrode of said circuit element with a desired conductive path via a metal connecting plate;
molding an insulating resin to cover said circuit element and be filled in said trench; and
removing said conductive foil in a thick portion where said trench is not provided. - View Dependent Claims (12, 13, 14, 15, 17, 19, 23)
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Specification