Moisture absorbing formed article

• US 20020183431A1
• Filed: 04/19/2002
• Published: 12/05/2002
• Est. Priority Date: 05/17/2000
• Status: Active Grant

• Current Assignee: Dynic Corporation
• Original Assignee: Dynic Corporation
• Inventors: Nishino, Atsushi, Kawaguchi, Yohei, Ohyama, Kaneto, Uchibori, Teruo, Fujimori, Masayuki
• Granted Patent: US 6,673,436 B2
• Time in Patent Office: Days
• US Class Current: 524/394
• CPC Class Codes: C08K 3/00 Use of inorganic substances as compounding ingredients
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/30 Sulfur-, selenium- or tellurium-containing compounds
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/258 Alkali metal or alkaline earth metal or compound thereof
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31544 Addition polymer is perhalogenated
• CPC Class Codes: Y10T 428/31938 Polymer of monoethylenically unsaturated hydrocarbon

Abstract

An object of the present invention is to provide a material which can absorb moisture with ease and certainly, which exists in an equipment such as an electronic device. The invention relates to a moisture absorbing formed body comprising a hygroscopic agent and a resinous component.

Claims

1. A moisture absorbing formed body comprising a hygroscopic agent and a resinous component.

2. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent comprises at least one member selected from the group consisting of the oxides of alkaline earth metals and sulfates.

3. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent is at least one member selected from the group consisting of CaO, BaO and SrO.

4. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent is a powder having a specific surface area of not less than 10 m²/g.

5. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent is a powder having a specific surface area of not less than 40 m²/g.

6. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent accounts for 30-95 weight % of the moisture absorbing formed body.

7. A moisture absorbing formed body according to claim 1 wherein the resinous component is at least one member selected from the group consisting of fluorine-containing resin, polyolefin resin, polyacrylic resin, polyacrylonitrile resin, polyamide resin, polyester resin and epoxy resin.

8. A moisture absorbing formed body according to claim 1 further comprising a gas absorbent.

9. A moisture absorbing formed body according to claim 8 wherein the gas absorbent comprises an inorganic porous substance.

10. A moisture absorbing formed body according to claim 1, the surface of which is covered wholly or in part with a resinous covering layer.

11. A moisture absorbing formed body according to claim 1, wherein the resinous component has been fibrillated.

12. A moisture absorbing formed body according to claim 1, wherein the hygroscopic agent is a powder composed of at least one member selected from the group consisting of CaO, BaO and SrO which has a specific surface area of not less than 10 m²/g and the resinous component is a fluorine-containing resin.

13. A moisture absorbing formed body according to claim 12 wherein the fluorine-containing resin has been fibrillated.

14. A moisture absorbing formed body according to claim 1 for electronic device use.