Moisture absorbing formed article

• US 6,673,436 B2
• Filed: 04/19/2002
• Issued: 01/06/2004
• Est. Priority Date: 05/17/2000
• Status: Expired due to Fees

• Current Assignee: Dynic Corporation
• Original Assignee: Dynic Corporation
• Inventors: Fujimori, Masayuki, Nishino, Atsushi, Kawaguchi, Yohei, Ohyama, Kaneto, Uchibori, Teruo
• Primary Examiner(s): NAKARANI, DHIRAJLAL S
• Application Number:
  US10/031,622
• Publication Number:
  US 20020183431A1
• Time in Patent Office: 627 Days
• Field of Search: 428/330, 428/331, 428/421, 428/422, 428/523, 524/423, 524/433
• US Class Current: 428/330
• CPC Class Codes: C08K 3/00 Use of inorganic substances as compounding ingredients
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/30 Sulfur-, selenium- or tellurium-containing compounds
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/258 Alkali metal or alkaline earth metal or compound thereof
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31544 Addition polymer is perhalogenated
• CPC Class Codes: Y10T 428/31938 Polymer of monoethylenically unsaturated hydrocarbon

Abstract

An object of the present invention is to provide a material which can absorb moisture with ease and certainly, which exists in an equipment such as an electronic device. The invention relates to a moisture absorbing formed body comprising a hygroscopic agent and a resinous component.

Claims

1. A moisture absorbing formed body comprising a hygroscopic agent and a resinous component,

wherein said hygroscopic agent is at least one selected from the group consisting of CaO, BaO and SrO, and

wherein said resinous component is at least one selected from the group consisting of fluorine-containing resin and polyolefin resin.

2. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent is a powder having a specific surface area of not less than 10 m²/g.

3. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent is a powder having a specific surface area of not less than 40 m²/g.

4. A moisture absorbing formed body according to claim 1 wherein the hygroscopic agent accounts for 30-95 weight % of the moisture absorbing formed body.

5. A moisture absorbing formed body according to claim 1 further comprising a gas absorbent.

6. A moisture absorbing formed body according to claim 5 wherein the gas absorbent comprises an inorganic porous substance.

7. A moisture absorbing formed body according to claim 1, the surface of which is covered wholly or in part with a resinous covering layer.

8. A moisture absorbing formed body according to claim 1 for electronic device use.

9. A moisture absorbing formed body according to claim 1 wherein said fluorine-containing resin is selected from the group consisting of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and ethylene-tetrafluoroethylene copolymer.

10. A moisture absorbing formed body comprising a hygroscopic agent and a resinous component, wherein the resinous component has been fibrillated.

11. A moisture absorbing formed body comprising a hygroscopic agent and a resinous component, wherein the hygroscopic agent is a powder composed of at least one member selected from the group consisting of CaO, BaO and SrO which has a specific surface area of not less than 10 m²/g and the resinous component is a fluorine-containing resin.

12. A moisture absorbing formed body according to claim 11 wherein the fluorine-containing resin has been fibrillated.