Integrated circuit chip with little possibility of becoming damaged and structure for mounting the same

• US 20030025201A1
• Filed: 07/09/2002
• Published: 02/06/2003
• Est. Priority Date: 07/13/2001
• Status: Abandoned Application

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Harada, Hiroshi
• Application Number:
  US10/191,989
• Publication Number:
  US 20030025201A1
• Time in Patent Office: Days
• US Class Current: 257/734
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/094 : Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated circuit chip in which enlarged lands are provided at four corners of the bottom surface of the integrated circuit chip, and a large amount of cream solder adheres to the enlarged lands, so that the four corners of the integrated circuit chip are firmly soldered to a mother board, as a result of which, even if an external force is applied when, for example, the integrated circuit chip and the mother board are subjected to shock or are twisted, the relative position between them does not easily change. In addition, even if a portion between the integrated circuit chip and the mother board is not reinforced by injecting an insulating adhesive therebetween, it is possible to provide a highly reliable integrated circuit chip, to increase working efficiency during the mounting process of the IC chip, and to reduce the possibility of solder connection portions becoming damaged due to changes in environmental temperature.

Claims

1. An integrated circuit chip including:

a semiconductor device and a bonding wire that are subjected to resin molding; and

a plurality of external connection lands, connected to the semiconductor device through the bonding wire, that are disposed at a bottom surface of the integrated circuit chip and that are soldered and mounted to a group of connection lands provided at a mother board;

wherein, of the plurality of external connection lands, at least the external connection lands that are disposed at four corners of the bottom surface of the integrated circuit chip are formed as enlarged lands that have areas that are larger than areas of the external connection lands that are disposed at other locations.

2. An integrated circuit chip according to claim 1, further including solder balls that are affixed to the corresponding external connection lands, wherein the enlarged lands are exposed at outer sides of the solder balls corresponding thereto.

3. An integrated circuit chip according to claim 2, wherein solder resist is provided between the plurality of external connection lands, with a portion of the solder resist being placed upon locations on the enlarged lands that surround the corresponding solder balls.

4. An integrated circuit chip according to claim 1, further including conductor terminals having the plurality of external connection lands formed at bottom surfaces of protruding portions of the conductor terminals by plating, and wherein, of the conductor terminals, the conductor terminals corresponding to the enlarged lands have diameters that are larger than diameters of the other conductor terminals.

5. A structure for mounting an integrated circuit chip, in which, when the integrated circuit chip is mounted to a mother board, a group of external connection lands and a group of connection lands are soldered with cream solder, with the integrated circuit chip comprising a semiconductor device and a bonding wire that are subjected to resin molding and the plurality of external connection lands, connected to the semiconductor device through the bonding wire, that are disposed at a bottom surface of the integrated circuit chip, and with the mother board having the group of connection lands disposed in an arrangement corresponding to that of the external connection lands;

wherein, of the external connection lands of the integrated circuit chip, at least the external connection lands disposed at four corners of the bottom surface of the integrated circuit chip are formed as enlarged lands that have areas that are larger than areas of the external connection lands disposed at other locations, and, of the connection lands disposed at the mother board, the connection lands that are soldered to the enlarged lands are formed with areas that are equal to the areas of the enlarged lands, so that an amount of cream solder that adheres to the enlarged lands is greater than an amount of cream solder that adheres to the other external connection lands during the mounting process.