Chip scale package with heat spreader and method of manufacture
First Claim
1. A method of assembly for a chip scale package, said chip scale package having a semiconductor die having an active surface having one of a plurality of bond pads thereon and a plurality of bond pads having a conductive projections thereon and an opposing second surface and having a metallic paddle frame having left and right side rails and having a paddle located therebetween, comprising:
- attaching the opposing second surface of said semiconductor die to said paddle for use of said paddle for a heat sink for said semiconductor die; and
disconnecting said paddle having said semiconductor die attached thereto from said metallic paddle frame.
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Accused Products
Abstract
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.
6 Citations
14 Claims
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1. A method of assembly for a chip scale package, said chip scale package having a semiconductor die having an active surface having one of a plurality of bond pads thereon and a plurality of bond pads having a conductive projections thereon and an opposing second surface and having a metallic paddle frame having left and right side rails and having a paddle located therebetween, comprising:
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attaching the opposing second surface of said semiconductor die to said paddle for use of said paddle for a heat sink for said semiconductor die; and
disconnecting said paddle having said semiconductor die attached thereto from said metallic paddle frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification