Touch panel and method of manufacturing the same

• US 20030096086A1
• Filed: 10/30/2002
• Published: 05/22/2003
• Est. Priority Date: 11/02/2001
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Matsumoto, Kenichi, Niho, Kenji, Tanabe, Koji, Takabatake, Kenichi, Fukui, Toshiharu
• Application Number:
  US10/283,509
• Publication Number:
  US 20030096086A1
• Time in Patent Office: Days
• US Class Current: 428/194
• CPC Class Codes: C09K 2323/05 Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: Y10T 428/24793 Comprising discontinuous or differential impregnation or bond

Abstract

An inexpensive touch panel securing a predetermined active area and yet being downsized is provided. The touch panel includes an upper substrate having an upper conductive layer beneath its lower face, and a lower substrate having a lower conductive layer on its upper face opposite to the upper conductive layer at a given interval. Pressing and heating a adhesive layer made from thermoplastic resin and hardener allows bonding the upper and lower substrates together. The touch panel is thus constructed.

Claims

1. A touch panel comprising:

an upper substrate having an upper conductive layer beneath a lower face thereof;

a lower substrate having a lower conductive layer on an upper face thereof;

a adhesive layer for bonding the upper substrate and the lower substrate together at a predetermined spot, the adhesive layer comprising thermoplastic resin and isocyanate hardener and having a width ranging from 0.5 to 2.5 mm.

2. The touch panel of claim 1, wherein at least one of the upper substrate and the lower substrate includes the adhesive layer formed by printing.

3. The touch panel of claim 1, wherein a thickness of the adhesive layer ranges from 5 to 50 μ

m.

4. The touch panel of claim 1, wherein an modulus of elasticity of the adhesive layer ranges from 10⁴ to 10⁹ Pa at room temperature.

5. The touch panel of claim 1, wherein the isocyanate hardener includes at least two isocyanate groups in one molecule.

6. The touch panel of claim 5, wherein an additive amount of the isocyanate hardener ranges from 1 to 10 in weight vs. an amount of the thermoplastic resin in weight of 100.

7. The touch panel of claim 1, wherein the thermoplastic resin of the adhesive layer is at least one of acrylic resin and polyester resin.

8. The touch panel of claim 1, wherein an average molecular weight of the thermoplastic resin of the adhesive layer is at least 2×

10⁵.

9. The touch panel of claim 1, wherein the adhesive layer is shaped like a frame, and corner portions of the adhesive layer are narrower than other portions.

10. The touch panel of claim 1 having a manufacturing method comprising the steps of:

printing the adhesive layer on at least one of the upper substrate and the lower substrate;

placing the upper conductive layer opposite to the lower conductive layer; and

bonding the upper substrate and the lower substrate together by one of heating plus pressing the adhesive layer and only pressing the adhesive layer.