Electronic component package

• US 20040065950A1
• Filed: 10/08/2002
• Published: 04/08/2004
• Est. Priority Date: 10/08/2002
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Agrawal, Gaurav, Sosh, Christopher E., Booker, Jesse W.
• Granted Patent: US 6,881,613 B2
• Time in Patent Office: Days
• US Class Current: 257/701
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4248 Feed-through connections for the hermetical passage of fibres through a package wall see provisionally also G02B6/4428
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10161 with a rectangular active surface
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.

Claims

1. An electronic component package comprising:

a ceramic substrate;

a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;

a bonding material formed on the bonding pads;

a plurality of electrical leads secured by the bonding material to corresponding pads; and

a layer of adhesive formed over at least the interfaces between the pads and ceramic.

2. The package according to claim1 wherein the adhesive material is a polymeric adhesive.

3. The package according to claim 2 wherein the adhesive is an epoxy.

4. The package according to claim 1 wherein the bonding material is a brazing material.

5. The package according to claim 1 wherein the adhesive has a thickness in the range 0.001 to 0.02 inches.

6. The package according to claim 1 wherein the package includes a semiconductor optoelectronic component and the bonding pads are electrically connected thereto.

7. The package according to claim 1 wherein the package includes an RF component.

8. The package according to claim 1 wherein the bonding pads extend from a top portion of the ceramic and along an edge portion of the ceramic, and the adhesive layer is formed on the top and edge portions.

9. The package according to claim 1 wherein the adhesive has an elastic modulus in the range 50,000 to 450,000 psi at room temperature.

10. A method of fabricating an electronic component package which includes a ceramic substrate, a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic, a bonding material formed over the pads, and a plurality of electrical leads secured by the bonding material to corresponding pads, the method comprising the steps of:

depositing an adhesive material over at least the interfaces between the pads and ceramic; and

bending the leads into a desired shape.

11. The method according to claim 10 wherein the adhesive is a polymeric adhesive.

12. The method according to claim 11 wherein the adhesive is an epoxy.

13. The method according to claim 10 wherein the thickness of the adhesive is in the range 0.001 to 0.02 inches.

14. The method according to claim 10 wherein the bonding pads extend from a top portion of the ceramic and along an edge portion of the ceramic, and the adhesive layer is formed on the entire top and edge portions including the pads.

15. The method according to claim 10 wherein the bonding material is a brazing material.

16. The method according to claim 10 wherein the leads are bent by cold forming.

17. The method according to claim 10 wherein the adhesive has an elastic modulus in the range 50,000 to 450,000 psi at room temperature.

18. An electronic component package comprising:

a ceramic substrate;

a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;

a bonding material formed on the bonding pads;

a plurality of electrical leads secured by the bonding material to corresponding pads; and

means for preventing cracking of the ceramic material comprising a layer of adhesive formed over at least the interfaces between the pads and ceramic.

19. The package according to claim 18 further comprising a semiconductor device mounted to the substrate, and wherein the bonding pads are electrically connected to the device.