Method for manufacturing digital micro-mirror device (DMD)

• US 20040150083A1
• Filed: 01/20/2004
• Published: 08/05/2004
• Est. Priority Date: 05/10/2000
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Choi, Jong-Kon
• Application Number:
  US10/761,835
• Publication Number:
  US 20040150083A1
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A method for manufacturing a semiconductor package is disclosed. A wafer including a plurality of semiconductor chips is provided. Each chip has one or more mirrors mounted thereon. Further, a plurality of bond pads formed on a periphery of the chip. Next, a photoresist is formed over the one or more mirrors. Then, the semiconductor chips are singulated from the wafer. One ore more semiconductor chips are mounted on a base substrate. The bond pads of the semiconductor chip are electrically connected with the base substrate. The photoresist is then removed from the semiconductor chips.

Claims

1. A digital micro-mirror device (DMD) packages, comprising:

a base substrate having a top surface and a bottom surface;

a metallic layer formed on the top surface of the base substrate;

a metallic adhesive formed on the metallic layer;

a semiconductor chip mounted on the metallic adhesive, the base substrate electrically connected with the semiconductor chip;

one or more mirrors mounted on the semiconductor chip;

a hermetic sealing means covering the semiconductor chip including the one more mirrors.

2. The DMD package of claim 1, which further comprises a heat sink attached on the bottom surface of the base substrate.