Laminated polymer with integrated lighting, sensors and electronics

• US 20040166335A1
• Filed: 08/05/2003
• Published: 08/26/2004
• Est. Priority Date: 08/06/2002
• Status: Abandoned Application

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: OʼRegan, Marie B., OʼBrien, Thomas C., Haas, C. Warren
• Application Number:
  US10/634,500
• Publication Number:
  US 20040166335A1
• Time in Patent Office: Days
• US Class Current: 428/457
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/205 Metallic coating
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/00 Layered products comprising a layer of synthetic resin fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: H10K 85/1135 Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
• CPC Class Codes: H10K 85/60 Organic compounds having low molecular weight H10K85/10 - H10K85/50 take precedence
• CPC Class Codes: H10K 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: Y02A 30/24 Structural elements or technologies for improving thermal insulation
• CPC Class Codes: Y02B 80/00 Architectural or constructional elements improving the thermal performance of buildings
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y10T 428/31504 : Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

This invention relates to laminated polymer as a host for solid state lighting, sensors, energy generation and storage devices and other electronics that are contained within the transparent non-glass interlayers or air cavities of the laminated polymer.

Claims

1. A laminated polymer comprised of at least two layers of transparent polymer with adjacent polymer layers separated by a transparent solid non-glass interlayer or an air cavity, wherein at least one said transparent non-glass interlayer or said air cavity contains a device comprised of at least one element selected from the group consisting of solid state lighting, heat sensors, light sensors, pressure sensors, thin film capacitance sensors, photovoltaic cells, thin film batteries, liquid crystal display films, suspended particle device films, and transparent electrical conductors.

2. The laminated polymer of claim 1, comprised of two layers of transparent polymer separated by a transparent solid non-glass interlayer.

3. The laminated polymer of claims 1 or 2, wherein said device is comprised of solid state lighting.

4. The laminated polymer of claim 3, wherein said solid state lighting is in the form of at least one light emitting diode.

5. The laminated polymer of claim 3, wherein said solid state lighting is in the form of at least one organic light emitting diode.

6. The laminated polymer of claim 3, wherein said solid state lighting is in the form of an electroluminescent film.

7. The laminated polymer of claim 3, wherein said device is further comprised of transparent electrical conductors to provide means to apply an activating voltage to said solid state lighting.

8. The laminated polymer of claim 7, wherein said transparent electrical conductors are indium tin oxide films.

9. The laminated polymer of claim 7, wherein said device is further comprised of a microprocessor chip that is programmed to control said solid state lighting and to cause said solid state lighting to display a sequence of images.

10. The laminated polymer of claim 9, wherein said microprocessor chip is programmed to cause said solid state lighting to display text.

11. The laminated polymer of claim 7, wherein there is provided externally to said laminated polymer a microprocessor chip that is programmed to control said solid state lighting and to cause said solid state lighting to display a sequence of images.

12. The laminated polymer of claim 11, wherein said microprocessor chip is programmed to cause said solid state lighting to display text.

13. The laminated polymer of claim 3, wherein the laminated polymer is flexible and can be adapted to various shapes and forms.

14. The laminated polymer of claim 13, wherein said solid state lighting is in the form of at least one light emitting diode.

15. The laminated polymer of claim 13, wherein said solid state lighting is in the form of at least one organic light emitting diode.