Wafer cleaning

  • US 20040206371A1
  • Filed: 12/03/2003
  • Published: 10/21/2004
  • Est. Priority Date: 09/30/1996
  • Status: Active Grant
First Claim
Patent Images

1. A method of processing a thin, flat substrate, comprising:

  • supporting the substrate in a generally horizontal orientation; and

    transmitting sonic energy to the substrate while flowing liquid onto both sides of the substrate to loosen particles on both sides of the substrate while maintaining said orientation.

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