INDUCTOR FORMED BETWEEN TWO LAYOUT LAYERS

• US 20040263308A1
• Filed: 10/06/2003
• Published: 12/30/2004
• Est. Priority Date: 06/11/2003
• Status: Abandoned Application

• Current Assignee: VIA Technologies Incorporated (VIA Technologies)
• Original Assignee: VIA Technologies Incorporated (VIA Technologies)
• Inventors: Li, Nicole, Yu, Jay, Hsu, Jimmy
• Application Number:
  US10/605,521
• Publication Number:
  US 20040263308A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/0093 Common mode choke coil
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components

Abstract

An inductor includes a first wiring layer, a second wiring layer, a first conductive trace, a second conductive trace, a third conductive trace, and a fourth conductive trace. The first conductive trace is on the first wiring layer and the second conductive trace is on the second wiring layer. The third conductive trace is parallel to the first conductive trace and is on the first wiring layer. The fourth conductive trace is parallel to the second conductive trace- and is on the second wiring layer. The first end of the first conductive trace is connected to the first end of the second conductive trace through a first via plug. The second end of the second conductive trace is connected to the first end of the third conductive trace through a second via plug. The second end of the third conductive trace is connected to the first end of the fourth conductive trace through a third via plug.

Claims

1. A printed circuit inductor comprising:

a first conductive trace formed on a first wiring layer of a printed circuit board;

a second conductive trace formed on a second wiring layer of a printed circuit board, wherein the second layer is disposed below and parallel to the first layer, the layers being separated by an insulating material;

a third conductive trace formed on the first wiring layer and parallel to the first conductive trace;

a fourth conductive trace formed on the second wiring layer and parallel to the second conductive trace;

a first via plug directly connected to a first end of the first conductive trace and to a first end of the second conductive trace;

a second via plug directly connected to a second end of the second conductive trace and to a first end of the third conductive trace; and

a third via plug directly connected to a second end of the third conductive trace and a to first end of the fourth conductive trace.

2. The inductor of claim 1 wherein the first via plug is perpendicular to the first conductive trace, the second via plug is perpendicular to the second conductive trace, and the third via plug is perpendicular to the third conductive trace.

3. A printed circuit inductor comprising:

a plurality of conductive traces formed on a plurality of wiring layers of a printed circuit board, wherein the conductive element of the inductor is formed from interconnected conductive traces disposed on separate wiring layers, each conductive trace having at least an end disposed coincident with an end of a conductive trace disposed on a separate layer allowing interconnection by a via;

a plurality of insulating layers for isolating the conductive layers from each other; and

a plurality of via plugs each directly connecting the conductive traces on different conductive layers.

4. The inductor of claim 3 wherein the plurality of conductive layers is formed having two layers.

5. The inductor of claim 3 wherein the plurality of via plugs is perpendicular to the plurality of conductive layers.

6. The inductor of claim 3 wherein the magnetic field generated by the inductor is in parallel with the conductive layers.