Transducers with electically conductive matching layers and methods of manufacture

• US 20050039323A1
• Filed: 08/22/2003
• Published: 02/24/2005
• Est. Priority Date: 08/22/2003
• Status: Abandoned Application

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Simens Medical Solutions USA Incorporated
• Inventors: Sheljaskow, Todor
• Application Number:
  US10/646,213
• Publication Number:
  US 20050039323A1
• Time in Patent Office: Days
• US Class Current: 29/594
• CPC Class Codes: G10K 11/02 Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49078 Laminated
• CPC Class Codes: Y10T 29/4908 Acoustic transducer

Abstract

Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electrical potential through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical potential through the thickness or range dimension of the matching layer are provided. For example, via, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the transducer material, in one step.

Claims

1. A method for manufacturing a multi-dimensional array of N×

M elements where both N and M are greater than 1, the method comprising;

(a) positioning at least two matching layers operable to conduct electric potential on at least one element of the array;

(b) dicing the at least two matching layers in azimuth and elevation; and

(c) electrically connecting one of the at least two matching layers to transducer material and another of the at least two matching layers to one of a ground foil and a signal trace.

2. The method of claim 1 wherein (a) comprises positioning three matching layers operable to conduct electric potential on the at least one element, and (b) comprises dicing the three matching layers.

3. The method of claim 1 wherein all matching layers on the at least one element are operable to conduct electric potential.

4. The method of claim 1 wherein (b) comprises dicing the at least two matching layers with cuts used to dice transducer material into the elements.

5. A multi-dimensional array of N×

M elements where both N and M are greater than 1, the array comprising;

transducer material arranged as the array of elements;

at least two electrically conductive matching layers on the transducer material.

6. The array of claim 5 further comprising:

kerfs defining the elements, the kerfs through both the transducer material and the at least two electrically conductive matching layers.

7. The array of claim 5 wherein the at least two electrically conductive matching layers comprises three electrically conductive matching layers.

8. The array of claim 5 wherein all matching layers on the array are electrically conductive.

9. A method for manufacturing a multi-dimensional array of N×

M elements where both N and M are greater than 1, the method comprising;

(a) positioning at least two matching layers on transducer material; and

(b) dicing the at least two matching layers and transducer material in azimuth and elevation at a same time, the dicing operable to separate a first element from a second element.