Aluminum heat sink for a solid state relay having ultrasonically welded copper foil

• US 20050086797A1
• Filed: 10/24/2003
• Published: 04/28/2005
• Est. Priority Date: 10/24/2003
• Status: Abandoned Application

• Current Assignee: Crydom Technologies
• Original Assignee: Crydom Technologies
• Inventors: Popescu, Eugen
• Application Number:
  US10/692,960
• Publication Number:
  US 20050086797A1
• Time in Patent Office: Days
• US Class Current: 29/622
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49105 Switch making

Abstract

Instead of soldering a circuit board or substrate to a nickel-plated aluminum heat sink for solid state relay applications, the present invention utilizes ultrasonic welding to weld a copper foil to a non-nickel-plated aluminum heat sink. The circuit board or substrate is subsequently soldered to the copper foil. The superior solderability of copper foil brings increased solder coverage between the heat sink and substrate, improving the heat transfer from the output switching element to the heat sink. This method eliminates the need for fixturing since the copper foil is surrounded by non-nickel-plated aluminum that is non-solderable by commonly used solders. This method also eliminates the high costs associated with nickel-plating and hazardous waste disposal, since no chemical wastes are produced. With this method, the same size solid state relay is now able to carry more current due to the better heat transfer and heat dissipation capabilities.

Claims

1. A method for making a solid state relay, the method comprising the steps of:

(a) welding ultrasonically a copper foil to a heat sink;

(b) soldering a substrate to said copper foil; and

(c) soldering an output switching element to said substrate;

wherein said copper foil increases solder coverage between said heat sink and said substrate, improving a heat transfer from said output switching element to said heat sink.

2. A method according to claim 1 wherein step (c) is replaced with a new step (c) and further comprises step (d):

(c) soldering at least one lead frame to said substrate; and

(d) soldering said output switching element to said at least one lead frame.

3. A method according to claim 1 wherein step (a) further comprises the step of:

welding ultrasonically said copper foil to a non-nickel-plated aluminum heat sink.

4. A method according to claim 1 wherein step (a) further comprises:

welding ultrasonically a portion of said copper foil to said heat sink in a first pass at between about 0.1 to 1.0 seconds at a power level of between about 2,000 to 4,000 watts.

5. A method according to claim 4 wherein step (a) further comprises:

welding ultrasonically additional portions of said copper foil to said heat sink in a plurality of additional passes that are essentially non-overlapping and parallel until all of said copper foil is welded to said heat sink.

6. A method according to claim 1 wherein step (a) further comprises:

welding ultrasonically said copper foil to said heat sink, wherein said copper foil is about 0.003 inches thick.

7. A method according to claim 1 wherein said at least one lead frame is made from at least a one of copper and nickel-plated copper.

8. A method according to claim 1 wherein step (b) further comprises soldering said substrate to said copper foil with at least a one of a solder composition of 60Sn/40Pb, 63Sn/37Pb, and 62Sn/36Pb/2Ag.

9. A solid state relay comprising:

a heat sink;

a copper foil ultrasonically welded to said heat sink;

a substrate soldered to said copper foil; and

an output switching element soldered to said substrate;

wherein said copper foil increases solder coverage between said heat sink and said substrate, improving a heat transfer from said output switching element to said heat sink.

10. The solid state relay according to claim 9 wherein at least one lead frame is soldered to said substrate instead of said output switching element, and said output switching element is soldered to said at least one lead frame.

11. The solid state relay according to claim 9 wherein said heat sink is made of a non-nickel-plated aluminum.

12. The solid state relay according to claim 9 wherein a portion of said copper foil is ultrasonically welded to said heat sink in a first pass at between about 0.1 to 1.0 seconds at a power level of between about 2,000 to 4,000 watts.

13. The solid state relay according to claim 12 wherein additional portions of said copper foil are ultrasonically welded to said heat sink in a plurality of additional passes that are essentially non-overlapping and parallel until all of said copper foil is welded to said heat sink.

14. The solid state relay according to claim 9 wherein said copper foil is about 0.003 inches thick.

15. The solid state relay according to claim 9 wherein said at least one lead frame is made from at least a one of copper and nickel-plated copper.

16. The solid state relay according to claim 9 wherein said substrate is soldered to said copper foil with at least a one of a solder composition of 60Sn/40Pb, 63Sn/37Pb, and 62Sn/36Pb/2Ag.