Electronic device, rubber product, and methods for manufacturing the same

• US 20050101060A1
• Filed: 10/08/2004
• Published: 05/12/2005
• Est. Priority Date: 10/08/2003
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Minagawa, Madoka, Hozoji, Hiroshi, Tsunoda, Shigeharu
• Granted Patent: US 7,172,130 B2
• Time in Patent Office: Days
• US Class Current: 438/127
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07764 the adhering arrangement making the record carrier attachable to a tire tire temperature or pressur control arrangements, see B60C23/00

Abstract

The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Claims

1. An electronic device comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna;

wherein the electronic device further comprises a release agent having a slippery surface, and wherein main surfaces of the module and spaces beside the module are enclosed by the slippery surface of the release agent.

3. The electronic device according to claim 1, wherein the module is covered with a protective film.

5. The electronic device according to any of claims 1 to 4, wherein the release agent having a slippery surface is coated with a surface lubricant.

2. An electronic device comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna;

wherein the electronic device further comprises a release agent having a slippery surface, and

wherein the module and spaces beside the module are enclosed by the slippery surface of the release agent, the module being movable in the spaces.

4. The electronic device according to claim 2, wherein the module is covered with a protective film.

6. A method for manufacturing an electronic device, the electronic device comprising a module which includes an RFID chip and an antenna, and the RFID chip being electrically connected to a main surface of the antenna;

wherein the electronic device further comprises a pair of release agents each having a slippery surface, each of the pair of release agents being larger than a projected image of the module, and

wherein the method comprises enclosing the module by the slippery surfaces of the pair of release agents.

7. The method according to claim 6, wherein the slippery surfaces of the pair of release agents are pasted together such that spaces in which the module is movable are kept beside the module.

8. A method for manufacturing an electronic device, the electronic device comprising a module which includes an RFID chip and an antenna, and the RFID chip being electrically connected to a main surface of the antenna;

wherein the electronic device further comprises a release agent coated with a surface lubricant, and

wherein the method comprises mounting the module on the release agent and bending the release agent to cover main surfaces of the module.

9. The method according to claim 8, wherein the release agent is pressure formed.

10. A rubber product comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna and the module being embedded in vulcanized rubber;

wherein the rubber product further comprises a release agent having a slippery surface, the slippery surface of the release agent enclosing main surfaces of the module and spaces beside the module.

12. The rubber product according to claim 10, wherein the module is covered with a protective film.

14. The rubber product according to any of claims 10 to 13,

wherein the release agent having a slippery surface is coated with a surface lubricant.

11. A rubber product comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna and the module being embedded in vulcanized rubber;

wherein the rubber product further comprises a release agent having a slippery surface, and

wherein the module and spaces beside the module are enclosed by the slippery surface of the release agent, the module being movable in the spaces.

13. The rubber product according to claim 11, wherein the module is covered with a protective film.

15. A method for manufacturing a rubber product, the rubber product comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna and the module being embedded in vulcanized rubber;

wherein the rubber product further comprises a pair of release agents each having a slippery surface, each of the pair of release agents being larger than an image produced by projection from above of the module, and

wherein the method comprises enclosing the module by the slippery surfaces of the pair of release agents and vulcanizing unvulcanized rubber to embed the module enclosed by the slippery surfaces of the pair of release agents in rubber.

16. The method according to claim 15, wherein the method further comprises;

pasting the slippery surfaces of the pair of release agents together such that spaces in which the module is movable are kept beside the module, and

vulcanizing unvulcanized rubber to embed the module and the spaces beside the module enclosed by the slippery surfaces pasted together of the pair of release agents in vulcanized rubber.

17. A method for manufacturing a rubber product, the rubber product comprising a module which includes an RFID chip and an antenna, the RFID chip being electrically connected to a main surface of the antenna and the module being embedded in vulcanized rubber;

wherein the rubber product further comprises a release agent having a slippery surface, the release agent comprising a base release agent coated with a surface lubricant; and

wherein the method comprises mounting the module on the release agent, bending the release agent so as to cover main surfaces of the module with the slippery surface of the release agent, and vulcanizing unvulcanized rubber to embed the module whose main surfaces are covered with the slippery surface of the release agent in vulcanized rubber.

18. The method according to claim 17;

wherein the release agent having a slippery surface is pressure formed, and

wherein the module whose main surfaces are covered with the slippery surface of the pressure formed release agent is embedded in vulcanized rubber.

19. A method for manufacturing a rubber product, the rubber product comprising an RFID chip and an antenna, and the RFID chip being electrically connected to a main surface of the antenna;

wherein the rubber product further comprises a pair of release agent s each having a slippery surface, and

wherein the method comprises covering the module with the slippery surfaces of the pair of release agents, and vulcanizing unvulcanized rubber to embed the module covered with the slippery surfaces of the pair of release agents in vulcanized rubber.

20. A method for manufacturing a rubber product, the rubber product comprising an RFID chip and an antenna, and the RFID chip being electrically connected to a main surface of the antenna;

wherein the rubber product further comprises a pair of release agents each having a slippery surface, and

wherein the method comprises;

covering the module with the slippery surfaces of the pair of release agents, either mounting the module covered with the slippery surfaces of the pair of release agents on vulcanized rubber or putting the module covered with the slippery surfaces of the pair of release agents in a hole formed in vulcanized rubber, and vulcanizing unvulcanized rubber to embed the module covered with the slippery surfaces of the pair of release agents in vulcanized rubber.