Electronic device, rubber product, and methods for manufacturing the same

• US 7,172,130 B2
• Filed: 10/08/2004
• Issued: 02/06/2007
• Est. Priority Date: 10/08/2003
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Minagawa, Madoka, Hozoji, Hiroshi, Tsunoda, Shigeharu
• Primary Examiner(s): WALSH, DANIEL I
• Application Number:
  US10/960,074
• Publication Number:
  US 20050101060A1
• Time in Patent Office: 851 Days
• Field of Search: 361/600, 361/679, 361/737, 361/752, 361/727, 361/725, 257787-795, 257/679, 257/682, 257/687, 438/106, 438/121, 438/124, 438125-127, 264/272.13, 264/17, 264/272.15, 264/272.12, 264/15, 235/492, 235/487, 235/472.02, 235/435, 235/451, 340/572.8, 340/693.9
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07764 the adhering arrangement making the record carrier attachable to a tire tire temperature or pressur control arrangements, see B60C23/00

Abstract

The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Claims

1. A method for manufacturing an electronic device, the electronic device comprising an RFID inlet which includes an RFID chip and an antenna provided opposite to each other, the RFID chip being electrically connected to the antenna, where the method comprises:

enclosing the RFID inlet in a base part having a release-agent surface so that surfaces of the RFID inlet oppose portions of the release-agent surface of the base part; and

sandwiching the RFID inlet between the portions of the release-agent surface of the base part, and pressing the portions of the release-agent surface of the base part onto the surfaces of the RFID inlet so that portions of the base part deform to interlock a position of a predetermined portion of the RFID chip with respect to the base part;

wherein extension portions of the base part extend beyond ends of the RFID inlet and have the release-agent surface opposing each other, to form a space therebetween to accommodate stress relief movement of the RFID inlet.

2. The method of manufacturing an electronic device according to claim 1, wherein the release-agent surface of the base part is processed to increase lubricity thereof.

3. The method of manufacturing an electronic device according to claim 2, wherein the base part is formed of paper, woven fabric or non-woven fabric.

4. The method of manufacturing an electronic device according to claim 2, wherein the release-agent surface of the base part includes a coating of a silicone resin or a tetrafluoride ethylene resin to increase the lubricity thereof.

5. The method of manufacturing an electronic device according to claim 2, wherein the release-agent surface of the base part is impregnated with wax or rosin.

6. The method of manufacturing an electronic device according to claim 1, wherein the base part is formed of a silicone resin or a tetrafluoride ethylene resin.

7. The method of manufacturing an electronic device according to claim 1, wherein the base part is provided as a pair of base parts each having one of the respective portions of the release-agent surface, and

each area of the pair of base parts is larger than an area of one of major surfaces of the RFID inlet opposite thereto, to thereby include the extension portions to form the spaces between the pair of base parts at both sides of the RFID inlet.

8. The method of manufacturing an electronic device according to claim 1, wherein

the base part is folded so that one of the respective portions of the release-agent surface thereof is pressed to one major surface of the RFID inlet and another of the respective portions of the release-agent surface thereof is pressed to another major surface of the RFID inlet.

9. The method of manufacturing an electronic device according to claim 1, wherein

the RFID inlet has a laminated structure including a pair of film sheets in which one major surface of the RFID inlet including the RFID chip is covered with one sheet of the pair of film sheets, and another major surface of the RFIID inlet is covered with another sheet of the pair of film sheets, and

one of the respective portions of the release-agent surface of the base part is pressed onto one major surface of the RFID inlet and the RFID chip via the one sheet, and another of the respective portions of the release-agent surface of the base part is pressed onto the another major surface of the RFID inlet via the another sheet.

10. The method of manufacturing an electronic, device according to claim 9, wherein

each of the pair of film sheets has an adhesive layer formed on a surface thereof,

the adhesive layer of the one sheet is pasted to the one major surface of the RFID inlet having the RFID chip included therein, and

the adhesive layer of the another sheet is pasted to the another major surface of the RFID inlet.

11. The method of manufacturing an electronic device according to claim 9, wherein

the pair of film sheets are polyimide film sheets.

12. An electronic device comprising:

an RFID inlet having an antenna and an RFID chip electrically connected to the antenna each disposed on one of main surfaces of the RFID inlet opposite to each other; and

a base part having a release surface formed of a release agent, and enclosing the RFID inlet so that surfaces of the RFID inlet are opposite to respective portions of the release surface of the base part,

wherein the respective portions of the release surface of the base part have a press-fit on the surfaces of the RFID inlet, so that portions of the base part have deformed to interlock a position of a predetermined portion of the RFID chip with respect to the base part; and

wherein extension portions of the base part extend beyond ends of the RFID inlet and have the release surface opposing each other, to form a space therebetween to accommodate stress relief movement of the RFID inlet.

13. A rubber product comprising the electronic device according to claim 12 which is embedded in vulcanized rubber.

14. The electronic device according to claim 12, wherein

the release surface of the base part has been treated processed to increase lubricity thereof.

15. The electronic device according to claim 14, wherein

the base part is formed of paper, woven fabric or nonwoven fabric.

16. The electronic device according to claim 14, wherein

the surface of the base part is coated with a silicone resin or a tetrafluoride ethylene resin to increase the lubricity thereof.

17. The electronic device according to claim 14, wherein

the release surface of the base part is impregnated with wax or rosin.

18. The electronic device according to claim 12, wherein

the base part is formed of a silicone resin or a tetrafluoride ethylene resin.

19. The electronic device according to claim 12, wherein

the base part comprises a pair of base parts each having the release surface, and

each of the pair of base parts is larger in area than an area of a major surface of the RFID inlet opposite thereto, to thereby include the extension portions to form the spaces between the pair of base parts at both sides of the RFID inlet.

20. The electronic device according to claim 12, wherein

the base part is folded so that one of the respective portions of the releas surface thereof is pressed to one major surface of the RFID inlet and another of the respective portions of the release surface thereof is pressed to another major surface of the RFID inlet.

21. The electronic device according to claim 12, wherein

the RFID inlet has a laminated structure including a pair of film sheets in which one major surface of the RFID inlet including the RFID chip is covered with one sheet of the pair of film sheets, and another major surface of the RFIID inlet is covered with another sheet of the pair of film sheets, and

one of the respective portions of the release surface of the base part is press-fit on one major surface of the RFID inlet and the RFID chip via the one sheet, and another of the respective portions of the release surface of the base part is press-fit on the another major surface of the RFID inlet via the another sheet.

22. The electronic device according to claim 21, wherein

each of the pair of film sheets has an adhesive layer formed on a surface thereof,

the adhesive layer of the one sheet is pasted to the one major surface of the RFID inlet having the RFID chip included therein, and

the adhesive layer of the another sheet is pasted to the another major surface of the RFID inlet.

23. The electronic device according to claim 21, wherein

the pair of film sheets are polyimide film sheets.

24. A method for manufacturing an electronic device, the electronic device comprising an RFID inlet which includes an RFID chip and an antenna provided opposite to each other, the RFID chip being electrically connected to the antenna, where the method comprises:

enclosing the RFID inlet in a base part having a release-agent surface so that surfaces of the RFID inlet oppose portions of the release-agent surface of the base part; and

sandwiching the RFID inlet between the portions of the release-agent surface of the base part, and pressing the portions of the release-agent surface of the base part onto the surfaces of the RFID inlet so that portions of the base part deform to the RFID chip to interlock a position of a predetermined portion of the RFID inlet with respect to the base part;

wherein extension portions of the base part extend beyond ends of the RFID inlet and have the release-agent surface opposing each other, to form a space therebetween to accommodate stress relief movement of the RFID inlet.