Advanced microelectronic heat dissipation package and method for its manufacture

• US 20050284616A1
• Filed: 06/01/2005
• Published: 12/29/2005
• Est. Priority Date: 08/28/2001
• Status: Abandoned Application

• Current Assignee: Advanced Materials Technology Pte Limited
• Original Assignee: Advanced Materials Technology Pte Limited
• Inventors: German, Randall M., Johnson, John, Tan, Lye-King
• Application Number:
  US11/141,885
• Publication Number:
  US 20050284616A1
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

Claims

1-21. -21. (canceled)

22. A heat pipe, for use with integrated circuits, comprising:

a solid body wherein is located a fully enclosed cavity whose diameter exceeds 1,000 microns, said cavity being lined with a porous material; and

a working fluid in said cavity.

23. The heat pipe described in claim 22 wherein said solid body is selected from the group consisting of copper, aluminum, tungsten, tungsten-copper, kovar, stainless steel, and nickel alloys.

24. The heat pipe described in claim 22 wherein said porous material is selected from the group consisting of copper, aluminum, tungsten, tungsten-copper, kovar, stainless steel, and nickel alloys.

25. The heat pipe described in claim 22 wherein said working fluid is selected from the group consisting of water, ammonia, acetone, and alcohol.

26-31. -31. (canceled)