High-sensitivity optical scanning using memory integration

• US 20060006311A1
• Filed: 09/14/2005
• Published: 01/12/2006
• Est. Priority Date: 06/22/2001
• Status: Active Grant

• Current Assignee: Orbotech Limited (KLA Corporation)
• Original Assignee: Orbotech Limited (KLA Corporation)
• Inventors: Katzir, Yigal, Malinovich, Yacov, Gur-Arie, Itay
• Granted Patent: US 7,129,509 B2
• Time in Patent Office: Days
• US Class Current: 250/208.100
• CPC Class Codes: G01N 21/8851 Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002
• CPC Class Codes: G01N 21/8901 Optical details; Scanning details per se G02B
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H04N 25/46 by combining or binning pixels
• CPC Class Codes: H04N 25/768 for time delay and integration [TDI]
• CPC Class Codes: H04N 25/772 comprising A/D, V/T, V/F, I/T or I/F converters
• CPC Class Codes: H04N 3/155 Control of the image-sensor operation, e.g. image processing within the image-sensor

Abstract

An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Claims