Reduction of Near Field Electro-Magnetic Scattering Using High Impedance Metallization Terminations

• US 20060035607A1
• Filed: 08/10/2004
• Published: 02/16/2006
• Est. Priority Date: 08/10/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Sony Ericsson Mobile Communications USA Incorporated (Sony Group Corp.)
• Inventors: Hayes, Gerard James, Vance, Scott Ladell
• Granted Patent: US 7,376,408 B2
• Time in Patent Office: Days
• US Class Current: 455/117
• CPC Class Codes: H04B 1/3838 Arrangements for reducing RF exposure to the user, e.g. by changing the shape of the transceiver while in use
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0234 Resistors or by disposing resistive or lossy substances in or near power planes H05K1/0246 takes precedence
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09354 Ground conductor along edge of main surface edge contacts H05K3/403
• CPC Class Codes: H05K 2201/10022 Non-printed resistor
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

The present invention uses metallization termination techniques to reduce the electro-magnetic field scattering at the edges of metallized areas. The metallization termination techniques provide a gradual transition from high conductivity areas to high impedance areas. The mobile phone antenna illuminates the PCB allowing currents to flow on the PCB. When the currents reach edges of the PCB they flow through a region of increasingly high impedance without reflecting back or scattering.

Claims

1. A method of attenuating scattering electro-magnetic waves present on metallized areas within a mobile phone that are caused by components within the mobile phone, the method comprising varying the metallization pattern near an edge of the metallized area such that electric current due to scattering electro-magnetic waves present on the metallized area encounters higher impedances as it approaches the edge of the metallized area.

2. A method of attenuating scattering electro-magnetic waves present on metallized areas within a mobile phone that are caused by components within the mobile phone, the method comprising placing discrete components near an edge of the metallized area such that electric current due to scattering electro-magnetic waves present on the metallized area encounters higher impedances due to the discrete components near the edge of the metallized area.

3. The method of claim 2 wherein the discrete components include resistors.

4. The method of claim 2 wherein the discrete components include capacitors.

5. The method of claim 2 wherein the discrete components include inductors.

6. The method of claim 2 wherein the discrete components include a combination of resistors, capacitors, and inductors.

7. A method of attenuating scattering electro-magnetic waves present on metallized areas within a mobile phone that are caused by components within the mobile phone, the method comprising placing capacitive gaps and inductive lines near an edge of the metallized area such that electric current due to scattering electro-magnetic waves present on the metallized area encounters higher impedances due to the capacitive gaps and inductive lines near the edge of the metallized area.

8. A method of attenuating scattering electro-magnetic waves present on metallized areas within a mobile phone that are caused by components within the mobile phone, the method comprising placing multiple varying layers of conductivity near an edge of the metallized area such that electric current due to scattering electro-magnetic waves present on the metallized area encounters higher impedances due to the multiple varying layers of conductivity near the edge of the metallized area.

9. A mobile phone that attenuates scattering electro-magnetic waves present on metallized areas within the mobile phone that are caused by components within the mobile phone, the mobile phone comprising:

a varied metallization pattern near an edge of metallized areas such that electric current due to scattering electro-magnetic waves present on the metallized areas encounters higher impedances as it approaches the edge of the metallized areas.

10. A mobile phone that attenuates scattering electro-magnetic waves present on metallized areas within the mobile phone that are caused by components within the mobile phone, the mobile phone comprising:

discrete components placed near an edge of metallized areas such that electric current due to scattering electro-magnetic waves present on the metallized areas encounters higher impedances due to the discrete components near the edge of the metallized areas.

11. The mobile phone of claim 10 wherein the discrete components include resistors.

12. The mobile phone of claim 10 wherein the discrete components include capacitors.

13. The mobile phone of claim 10 wherein the discrete components include inductors.

14. The mobile phone of claim 10 wherein the discrete components include a combination of resistors, capacitors, and inductors.

15. A mobile phone that attenuates scattering electro-magnetic waves present on metallized areas within the mobile phone that are caused by components within the mobile phone, the mobile phone comprising:

capacitive gaps and inductive lines placed near an edge of metallized areas such that electric current due to scattering electro-magnetic waves present on the metallized areas encounters higher impedances due to the capacitive gaps and inductive lines near the edge of the metallized areas.

16. A mobile phone that attenuates scattering electro-magnetic waves present on metallized areas within the mobile phone that are caused by components within the mobile phone, the mobile phone comprising:

multiple varying layers of conductivity placed near an edge of metallized areas such that electric current due to scattering electro-magnetic waves present on the metallized areas encounters higher impedances due to the multiple varying layers of conductivity near the edge of the metallized areas.