Method of clearing electrical contact pads in thin film sealed OLED devices

• US 20060051951A1
• Filed: 06/27/2005
• Published: 03/09/2006
• Est. Priority Date: 06/26/2004
• Status: Active Grant

• Current Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Original Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Inventors: Ghosh, Amalkumar P., Liu, Yachin, Ji, Hua Xia
• Granted Patent: US 7,745,340 B2
• Time in Patent Office: Days
• US Class Current: 438/612
• CPC Class Codes: H01L 21/02098 only involving lasers, e.g. laser ablation
• CPC Class Codes: H01L 21/31127 Etching organic layers
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/8501 Cleaning, e.g. oxide removal step, desmearing
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals

Abstract

A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.

Claims

1. A process of cleaning wire bond pads associated with OLED devices, comprising the steps of depositing on said wire bond pads one or more layers of ablatable material, and ablating said one or more layers with a laser, thereby exposing a clean wire bond pad.