Target and method of diffusion bonding target to backing plate

  • US 20060065517A1
  • Filed: 06/11/2003
  • Published: 03/30/2006
  • Est. Priority Date: 06/14/2002
  • Status: Abandoned Application
First Claim
Patent Images

1. A sputter target assembly comprising:

  • a target comprised of a first material and having a mating surface;

    an interlayer comprised of a second material;

    a backing plate comprised of a third material and having a mating surface, wherein the interlayer is intermetallically diffusion bonded with the mating surfaces of the target and backing plate during a HIP process.

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