Structure of image sensor package

• US 20060086899A1
• Filed: 10/21/2005
• Published: 04/27/2006
• Est. Priority Date: 10/21/2004
• Status: Abandoned Application

• Current Assignee: Chipmos Technologies Limited Chipmos Technologies Incorporated
• Original Assignee: ChipMOS TECHNOLOGIES (Bermuda) LTD. (Chipmos), Chipmos Technologies Incorporated (Chipmos)
• Inventors: Liu, An-Hong, Lee, Yao-Jung, Chao, Yeong-Ching
• Application Number:
  US11/254,676
• Publication Number:
  US 20060086899A1
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An image sensor package comprises a carrier, an image sensor chip, and a transparent substrate where the carrier has a chip cavity and a plurality of first pads formed around the chip cavity. A plurality of bonding pads are formed on the active surface of the image sensor chip. The image sensor chip is disposed in the chip cavity. A plurality of probe leads are formed on the transparent substrate. The probe leads have a plurality of free tips. When the transparent substrate is adhered to the carrier, the image sensor chip is hermetically sealed, and the free tips are electrically contacted to the bonding pads of the image sensor chip, and the probe leads are electrically connected to the first pads of the carrier. The height variations of the image sensor chip in the chip cavity can be offset by the probe leads.

Claims

1. An image sensor package comprising:

a carrier having a first surface, a second surface, and a chip cavity in the first surface, wherein a plurality of first pads are formed on the first surface around the chip cavity;

an image sensor chip disposed in the chip cavity and having an active surface and a back surface, wherein a plurality of bonding pads are formed on the active surface; and

a transparent substrate including a plurality of probe leads, wherein the probe leads have a plurality of free tips;

when the transparent substrate is adhered to the carrier, the image sensor chip is hermetically sealed, and the free tips are electrically contacted to the bonding pads of the image sensor chip, and the probe leads are electrically connected to the first pads of the carrier.

2. The image sensor package of claim 1, wherein the probe leads are cantilevered.

3. The image sensor package of claim 1, wherein the free tips of the probe leads are formed by wire-bonding plus plating.

4. The image sensor package of claim 1, wherein the probe leads are MEMS (micro-electro-mechanical-system) probes.

5. The image sensor package of claim 1, further comprising an ACP (anisotropic conductive paste) or NCP (non-conductive paste) disposed between the carrier and the transparent substrate.

6. The image sensor package of claim 1, further comprising a plurality of pre-solder materials formed on the bonding pads.

7. The image sensor package of claim 1, wherein a plurality of wetting layers are formed on the bonding pads.

8. The image sensor package of claim 1, wherein the carrier has a plurality of second pads on the second surface.

9. The image sensor package of claim 8, further comprising a plurality of solder balls on the second pads.

10. The image sensor package of claim 8, wherein the carrier has a plurality of plated through holes between the first pads and the second pads.