High power LED package with universal bonding pads and interconnect arrangement

• US 20060091416A1
• Filed: 10/26/2005
• Published: 05/04/2006
• Est. Priority Date: 10/29/2004
• Status: Active Grant

• Current Assignee: LED Engin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Granted Patent: US 7,473,933 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

LED packages are provided that can accommodate more than one type of LED. These packages include at least three bonding pads arranged such that two are appropriate for one type of LED, while another two are appropriate for another type of LED. Packages can include a thermally conductive layer on which the bonding pads and associated traces are disposed. The packages can also include electrical contacts on either of their top or bottom surfaces that are electrically coupled to the bonding pads by metallized vias or partial vias defined along edges or corners of the packages. Packages for multiple LEDs are also provided. These packages can enable the LEDs to be selectively operable.

Claims

1. A universal LED package for accommodating different LED types, the package comprising:

a body including

top and bottom surfaces;

a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface; and

first, second, and third electrically conductive bonding pads disposed on the floor of the cavity, the first and second bonding pads arranged to provide electrical contacts for a first LED type, and the first and third bonding pads arranged to provide electrical contacts for a second LED type.

2. The package of claim 1 wherein one of the electrically conductive bonding pads is centrally located on the floor within the cavity.

3. The package of claim 1 further comprising an electrical path connecting the first pad to an exterior contact.

4. The package of claim 3 wherein the exterior contact is disposed on the bottom surface.

5. The package of claim 3 wherein the exterior contact is disposed on the top surface.

6. The package of claim 3 wherein the electrical path includes a metallized partial via.

7. The package of claim 1 wherein the body includes a ceramic layer between the floor of the cavity and the bottom surface.

9. The LED package of claim 1 wherein the body further includes a top body layer disposed above the ceramic layer, and the cavity is disposed through the top body layer.

10. The LED package of claim 9 wherein the top body layer comprises a ceramic.

8. An LED package comprising:

a body including

top and bottom surfaces;

a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface;

a ceramic layer between the floor of the cavity and the bottom surface; and

first and second electrically conductive bonding pads disposed on the floor of the cavity, the first and second bonding pads configured to completely cover the floor of the cavity except for a narrow gap therebetween.

11. A package for multiple LEDs comprising:

a body including

top and bottom surfaces;

a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface;

a thermally conducting material disposed between the floor and the bottom surface;

a plurality of LED bonding pads disposed on the floor; and

a plurality of electrical bonding pads disposed on the floor proximate to the LED bonding pads and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

12. The package of claim 11 wherein the thermally conducting material comprises a ceramic.

13. The package of claim 11 wherein the plurality of LED bonding pads are non-electrically conductive.

14. The package of claim 11 wherein the plurality of electrical contacts are disposed on the bottom surface of the body.

16. The package of claim 11 wherein the plurality of electrical bonding pads are in electrical communication with the plurality of electrical contacts through a plurality of vias.

17. The package of claim 16 wherein a via of the plurality of vias comprises a partial via.

18. The package of claim 11 further comprising an ESD protection device coupled between two of the plurality of electrical bonding pads.

15. The package of claim 111 wherein the plurality of electrical contacts are disposed on the top surface of the body.

19. A light emitting device comprising:

a body including

top and bottom surfaces,

a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface,

a thermally conducting material disposed between the floor and the bottom surface,

a plurality of LED bonding pads disposed on the floor, and

a plurality of electrical bonding pads disposed on the floor proximate to the LED bonding pads and in electrical communication with a plurality of electrical contacts disposed on a surface of the body; and

a plurality of LED dies disposed on the plurality of LED bonding pads and electrically coupled to the plurality of electrical bonding pads.

20. The light emitting device of claim 19 wherein the LED dies are electrically connected in series.

21. The light emitting device of claim 19 wherein the LED dies are selectively operable.

22. The light emitting device of claim 19 wherein the plurality of LED bonding pads are electrically conductive.

23. The light emitting device of claim 19 further comprising a luminescent layer disposed over the LED dies.

24. The light emitting device of claim 23 further comprising a thermal insulation layer between the luminescent layer and the LED dies.