High power LED package with universal bonding pads and interconnect arrangement

  • US 7,473,933 B2
  • Filed: 10/26/2005
  • Issued: 01/06/2009
  • Est. Priority Date: 10/29/2004
  • Status: Active Grant
First Claim
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1. A package for multiple LEDs comprising:

  • a body includingtop and bottom surfaces;

    a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface;

    a thermally conducting material disposed between the floor and the bottom surface;

    a plurality of LED bonding pads disposed on the floor; and

    a plurality of electrical bonding pads disposed on the floor proximate to the LED bonding pads and in electrical communication with a plurality of electrical contacts disposed on a surface of the body, the plurality of electrical bonding pads in electrical communication with the plurality of electrical contacts through a plurality of vias and at least one of the plurality of vias consisting of a partial via.

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