Method of creating an RFID tag with substantially protected rigid electronic component
First Claim
Patent Images
1. An electronic assembly comprising:
- a flexible substrate;
a protective layer that is arranged adjacent to one side of said substrate, that has a first thickness and that defines at least one hole; and
a first electrical component that has a second thickness that is less than or equal to said first thickness and that is received in said hole in said protective layer.
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Accused Products
Abstract
An electronic assembly and method for making the same includes a flexible substrate and a protective layer arranged adjacent to one side of the substrate. The protective layer has a first thickness and defines at least one hole. A first electrical component has a second thickness that is less than or equal to the first thickness. The first electrical component is received in the hole in the protective layer.
24 Citations
25 Claims
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1. An electronic assembly comprising:
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a flexible substrate;
a protective layer that is arranged adjacent to one side of said substrate, that has a first thickness and that defines at least one hole; and
a first electrical component that has a second thickness that is less than or equal to said first thickness and that is received in said hole in said protective layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic assembly, comprising:
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a printing web;
first electrical components printed on said printing web;
a protective layer that is attached to at least one of said printing web and said first electrical components and that defines holes therein; and
second rigid electrical components that are attached to said first electrical components in said holes;
wherein said protective layer has a first thickness that is greater than or equal to a second thickness of said second rigid electrical component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A method of attaching an integrated circuit to a printing web, comprising:
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providing a continuous printing web defining a substrate;
forming holes in a protective layer that has a first thickness;
attaching said protective layer to said substrate; and
attaching first electrical components having a second thickness to said substrate in said holes, wherein said first thickness is greater than or equal to said second thickness. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification