Method for the production of an electrically conductive resistive layer and heating and/or cooling device

• US 20060108354A1
• Filed: 01/09/2006
• Published: 05/25/2006
• Est. Priority Date: 12/19/2001
• Status: Abandoned Application

• Current Assignee: Watlow Electric Manufacturing Company
• Original Assignee: Watlow Electric Manufacturing Company
• Inventors: Russegger, Elias
• Application Number:
  US11/328,469
• Publication Number:
  US 20060108354A1
• Time in Patent Office: Days
• US Class Current: 219/543
• CPC Class Codes: C23C 24/04 Impact or kinetic deposition of particles
• CPC Class Codes: C23C 30/00 Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process C23C26/00, C23C28/00 take precedence
• CPC Class Codes: C23C 4/01 Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
• CPC Class Codes: C23C 4/06 Metallic material
• CPC Class Codes: C23C 4/08 containing only metal elements C23C4/073 takes precedence
• CPC Class Codes: C23C 4/16 Wires; Tubes
• CPC Class Codes: C23C 4/18 After-treatment
• CPC Class Codes: F24H 1/142 using electric energy supply
• CPC Class Codes: H01C 17/24 by removing or adding resistive material H01C17/23, H01C17/232, H01C17/235 take precedence
• CPC Class Codes: H01C 17/245 by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
• CPC Class Codes: H05B 3/46 heating conductor mounted on insulating base
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base

Abstract

An electrically conductive resistive layer is produced by thermally spraying an electrically conductive material onto the surface of a non-conductive substrate. Initially, the material layer arising therefrom has no desired shape. The material layer is then removed in certain areas so that an electrically conductive resistive layer having said desired shape is produced.

Claims

1. A method of forming an electrically conductive resistive layer comprising the steps of:

(a) forming an electrically conductive material onto a complex shaped substrate;

(b) removing areas of the electrically conductive material to form a meander shape of the electrically conductive resistive layer.

2. The method according to claim 1, wherein the electrically conductive material is formed onto the substrate by a process selected from the group consisting of thermal spraying, plasma spraying, flame spraying, arc spraying, autogenious spraying, laser spraying, and cold gas spraying.

3. The method according to claim 1, wherein the areas of electrically conductive material are removed by a process selected from the group consisting of laser, water jet, and powder sand blasting.

4. The method according to claim 1, wherein during removal of the electrically conductive material to form the desired shape, an electrical resistance (WIST) of the shape is obtained.

5. The method according to claim 4, wherein the actual electrical resistance (WIST) of the shape is compared to a desired value (WSOLL) and certain areas of electrically conductive material are removed to reduce the difference between the actual electrical resistance (WIST) and the desired value (WSOLL).

6. The method according to claim 5, wherein the obtaining of the electrical resistance (WIST) of the shape and the removal of material to reduce the difference between the actual electrical resistance (WIST) and the desired value (WSOLL) are performed in parallel.

7. The method according to claim 1 further comprising the step of locally adjusting the shape with the removal process to provide desired electrical properties along the shape.

8. The method according to claim 1 further comprising the step of sealing the electrically conductive resistive layer.

9. The method according to claim 1, wherein the step of sealing is conducted under vacuum.

10. The method according to claim 1, wherein an electrical resistance of the electrically conductive resistive layer is locally adjusted using heat treatment to provide a desired electrical resistance properties along the meander shape.

11. A method of forming a heater comprising the steps of:

(a) forming a nonconductive layer over a complex shaped substrate;

(b) forming an electrically conductive material onto the nonconductive layer;

(c) removing areas of the electrically conductive material to form a meander shape of the electrically conductive resistive layer.

12. The method according to claim 11, wherein the electrically conductive material is formed onto the substrate by a process selected from the group consisting of thermal spraying, plasma spraying, flame spraying, arc spraying, autogenious spraying, laser spraying, and cold gas spraying.

13. The method according to claim 11, wherein the areas of electrically conductive material are removed by a process selected from the group consisting of laser, water jet, and powder sand blasting.

14. The method according to claim 11, wherein during removal of the electrically conductive material to form the desired shape, an electrical resistance (WIST) of the shape is obtained.

15. The method according to claim 14, wherein the actual electrical resistance (WIST) of the shape is compared to a desired value (WSOLL) and certain areas of electrically conductive material are removed to reduce the difference between the actual electrical resistance (WIST) and the desired value (WSOLL).

16. The method according to claim 15, wherein the obtaining of the electrical resistance (WIST) of the shape and the removal of material to reduce the difference between the actual electrical resistance (WIST) and the desired value (WSOLL) are performed in parallel.

17. The method according to claim 11 further comprising the step of locally adjusting the shape with the removal process to provide desired electrical properties along the shape.

18. The method according to claim 11 further comprising the step of sealing the electrically conductive resistive layer.

19. The method according to claim 11, wherein the step of sealing is conducted under vacuum.

20. The method according to claim 11, wherein an electrical resistance of the electrically conductive resistive layer is locally adjusted using heat treatment to provide a desired electrical resistance properties along the meander shape.