Workpiece processing using ozone gas and chelating agents

• US 20060151007A1
• Filed: 03/09/2006
• Published: 07/13/2006
• Est. Priority Date: 05/09/1997
• Status: Abandoned Application

• Current Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Original Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Inventors: Bergman, Eric J.
• Application Number:
  US11/371,559
• Publication Number:
  US 20060151007A1
• Time in Patent Office: Days
• US Class Current: 134/26
• CPC Class Codes: B08B 2203/005 the liquid being ozonated
• CPC Class Codes: B08B 2203/007 Heating the liquid
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

In systems and methods for cleaning a wafer having an oxide on a surface of the wafer, an aqueous liquid including a chelating agent is applied onto the wafer, while the wafer is also contacted by ozone gas. The ozone readily oxidizes the contaminants in the presence of the aqueous liquid. The chelating agent helps to remove metal contamination from the wafer, without the need for an acid such as hydrofluoric or hydrochloric acid. Etching of the oxide layer is accordingly reduced. The wafer can be effectively cleaned using aqueous liquid and ozone, while largely preserving the oxide layer needed for certain types of micro-scale devices formed on the wafer.

Claims

1. A method for cleaning one or more workpieces comprising:

placing the workpiece into a processing chamber, with an oxide layer on at least part of the workpiece;

introducing an aqueous liquid including a chelating agent onto the workpiece;

introducing ozone into the processing chamber;

with the ozone cleaning oxidizable contaminants from the workpiece, and with the chelating agent cleaning metal contaminants from the workpiece.

2. The method of claim 1 wherein the ozone is introduced into the processing chamber as a dry gas.

3. The method of claim 1 wherein the liquid is heated to a temperature of 30-95°

C.

4. The method of claim 1 wherein the liquid is substantially free of hydrofluoric or hydrochloric acid.

5. The method of claim 1 wherein the workpiece comprises a silicon wafer, and the contaminant comprises photoresist.

6. The method of claim 1 further comprising the step of rotating the workpiece within the processing chamber.

7. The method of claim 1 wherein the ozone is entrained in the liquid before the liquid is introduced onto the workpiece.

8. The method of claim 1 wherein the liquid and the ozone are introduced separately into the processing chamber.

9. The method of claim 1 wherein the liquid is sprayed onto the workpiece.

10. The method of claim 1 with the liquid further comprising an additive selected from the group consisting of hydrogen peroxide, ammonium hydroxide, ammonium fluoride, tetramethyl ammonium hydroxide, and choline.

11. The method of claim 1 further comprising rotating a batch of workpieces in the process chamber.

12. The method of claim 1 where the chelating agent comprises a member selected from the group consisting of triethanolamine, diethlenetriaminopentaacetic acid, 1,2-cyclohexanediaminotetraacetic acid, hydrozyethidiphosphonic acid. Dethylenetriaminepenta, ethylenediaminetetracetic acid, and pyridinone acetic acid.

13. The method of claim 12 with the chelating agent having a concentration in the liquid of from 1-100 ppm.

14. A method for processing one or more workpieces having an oxide layer, comprising:

heating a liquid including de-ionized water and a chelating agent;

forming a layer of the heated liquid on the surface of the workpiece; and

contacting the surface of the workpiece with ozone gas in the layer of heated liquid, with the ozone chemically reacting with an oxidizable contaminant at the surface of the workpiece, and with the chelating agent chemically reacting with a metal contaminant, to process the workpiece.

15. The method of claim 14 further including placing the workpiece into a chamber and pressurizing the chamber.

16. The method of claim 14 further including spraying the liquid onto the surface of the workpiece and rotating the workpiece.

17. The method of claim 14 further comprising introducing sonic energy into the liquid.

18. The method of claim 14 further comprising irradiating the workpiece with ultra-violet or infra-red light.

19. The method of claim 14 wherein oxide loss is less than 10 angstroms.

20. A method for cleaning one or more workpieces having an oxide layer on a surface of the workpiece, comprising:

placing the workpiece into a chamber;

heating a liquid including de-ionized water, ammonium hydroxide and a chelating agent;

forming a layer of the heated liquid on the surface of the workpiece; and

providing ozone gas into the chamber, with the ozone gas chemically reacting with a contaminant at the surface of the workpiece, and with the chelating agent chemically reacting with a metal contaminant, to process the workpiece, and with the oxide layer thickness remaining substantially unchanged.

21. An apparatus for cleaning a workpiece comprising:

a chamber;

a workpiece holder in the chamber;

liquid outlets in the chamber positioned to apply liquid onto at least one surface of a workpiece supported by the workpiece holder;

a source of aqueous liquid connecting with the liquid outlets, with the aqueous liquid including a chelating agent;

a heater for heating the aqueous liquid; and

a source of ozone gas connecting into the chamber.

22. The apparatus of claim 21 wherein the workpiece holder comprises a rotor for rotating the workpiece.

23. The apparatus of claim 21 with the aqueous liquid further including ammonium hydroxide.

24. Apparatus comprising:

(a) means for forming a layer of a heated aqueous liquid on the surface of a workpiece, with the aqueous liquid including a chelating agent;

(b) means for supplying ozone gas to the surface of the workpiece, where the ozone oxidizes contamination on the surface to clean the workpiece.

25. The apparatus of claim 24 further including means for heating the surface of the workpiece.