RFID tag applicable to metallic environment

• US 20060181419A1
• Filed: 01/28/2005
• Published: 08/17/2006
• Est. Priority Date: 01/28/2005
• Status: Abandoned Application

• Current Assignee: Wha Yu Industrial Co., Ltd.
• Original Assignee: Wha Yu Industrial Co., Ltd.
• Inventors: Ciou, Jian-Jhih, Wang, Liang-Cin, Chen, Shih-Zong
• Application Number:
  US11/044,312
• Publication Number:
  US 20060181419A1
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Abstract

The RFID tag applicable to metallic environment, is fitted with a dielectric substrate adhered to conducting antenna. And, a wireless telecommunication IC is linked to antenna, which is provided with a radiator and a grounding terminal. The radiator is mounted onto the surface of dielectric substrate, and the grounding terminal is mounted onto the back of dielectric substrate. The entire antenna unit is available with a resonant mode or radiation mechanism, whereas a wireless telecommunication IC is electrically linked between radiator and grounding terminal. This complete structure of RFID tag enables correct read/write of reader/writer for use with metallic products.

Claims

1. A RFID tag applicable to metallic environment comprising:

a dielectric substrate, adhered to conducting an antenna; and

a wireless telecommunication IC linked to said antenna, being comprised of a radiator and a grounding terminal, said radiator being mounted onto a surface of dielectric substrate, and the grounding terminal being mounted onto a back of said dielectric substrate, the antenna having a resonant mode or radiation mechanism, wherein said wireless telecommunication IC is electrically linked between said radiator and said grounding terminal.