Semiconductor device and manufacturing method thereof
First Claim
Patent Images
1. A semiconductor device comprising:
- a semiconductor substrate;
a first insulating film formed over said semiconductor substrate;
a second insulating film formed on said first insulating film;
a contact plug made of a conductive material, said plug vertically penetrating said first and second insulating films and extending on said second insulating film; and
a conductive film in contact with the upper surface of said contact plug and part of said second insulating film.
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Abstract
A semiconductor device comprises a first insulating film formed over a semiconductor substrate, a second insulating film formed on the first insulating film, a contact plug made of a conductive material vertically penetrating the first and second insulating films and extending on the second insulating film, and a conductor film in contact with the upper surface of the contact plug and part of the second insulating film. This construction makes it possible to form minute via-holes in a mass-production line without increasing parasitic capacity, increasing the number of manufacturing steps, and generating defects.
43 Citations
21 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate;
a first insulating film formed over said semiconductor substrate;
a second insulating film formed on said first insulating film;
a contact plug made of a conductive material, said plug vertically penetrating said first and second insulating films and extending on said second insulating film; and
a conductive film in contact with the upper surface of said contact plug and part of said second insulating film. - View Dependent Claims (2, 5)
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3. A semiconductor device comprising:
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a semiconductor substrate having a memory cell region and a peripheral region;
an alignment mark for positioning which is made of a conductive material and formed in said peripheral region;
a first insulating film which covers said alignment mark and extends to said memory cell region;
a second insulating film formed on said first insulating film;
a contact plug made of a conductive material, said plug vertically penetrating said first and second insulating films and extending on said second insulating film;
a storage node in contact with the upper surface of said contact plug and part of said second insulating film; and
a dielectric film which covers said storage node and is in contact with said second insulating film. - View Dependent Claims (4, 6)
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7. A method of manufacturing a semiconductor device, comprising the steps of:
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forming a first insulating film above a semiconductor substrate;
forming a second insulating film on said first insulating film;
forming a third insulating film on said second insulating film, said third insulating film having a low etching rate in relation to a first etchant for said first insulating film;
forming an opening portion so as to extend through said third and second insulating films up to said first insulating film;
forming a spacer on the side wall of said opening portion, said spacer having a low etching rate in relation to said first etchant for said first insulating film;
forming a contact hole so as to extend through said first insulating film, using said third insulating film and said spacer as masks;
filling said opening portion and said contact hole with a first conductive material to form a contact plug; and
selectively removing said third insulating film using a second etchant whose etching rate to said second insulating film is low. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a semiconductor device having a memory cell region and a peripheral region, comprising the steps of:
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forming an alignment mark for positioning made of a conductive material, in said peripheral region;
forming a first insulating film so as to cover said alignment mark and extend to said memory cell region;
forming a second insulating film on said first insulating film;
forming a third insulating film on said second insulating film, said third insulating film having a low etching rate in relation to a first etchant for said first insulating film;
forming an opening portion so as to extend through said third and second insulating films up to said first insulating film;
forming a spacer on the side wall of said opening portion, said spacer having a low etching rate in relation to said first etchant for said first insulating film;
forming a first contact hole so as to extend through said first insulating film, using said third insulating film and said spacer as masks;
filling said opening portion and said first contact hole with a first conductive material to form a contact plug; and
selectively removing said third insulating film using a second etchant whose etching rate to said second insulating film is low. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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Specification