Implantable device using ultra-nanocrystalline diamond

• US 20060235475A1
• Filed: 06/12/2006
• Published: 10/19/2006
• Est. Priority Date: 02/28/2001
• Status: Active Grant

• Current Assignee: Second Sight Medical Products, Inc.
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Greenberg, Robert J., Mech, Brian V.
• Granted Patent: US 8,214,032 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61K 9/0009 involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis microelectromechanical systems A61K9/0097
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: C23C 16/274 using microwave discharges
• CPC Class Codes: C23C 16/277 using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
• CPC Class Codes: C23C 16/278 doping or introduction of a secondary phase in the diamond
• CPC Class Codes: C23C 16/279 control of diamond crystallography
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An implantable biocompatible device, that may be either a sensor or stimulator, having electronic circuitry and electrodes formed on a substrate, is uniformly covered with a coating approximately one-micron thick of ultra-nanocrystalline diamond, hermetically sealing the electronic circuitry. Selected electrodes are either left uncovered during coating or uncovered by conventional patterning techniques, allowing the electrodes to be exposed to living tissue and fluids. The ultra-nanocrystalline diamond coating may be doped to create electrically conductive electrodes. These approaches eliminate the need for a hermetically sealed lid or cover to protect hybrid electronic circuitry, and thus allow the device to be thinner than otherwise possible. The conformal ultra-nanocrystalline diamond coating uniformly covers the device, providing relief from sharp edges and producing a strong, uniformly thick hermetic coating around sharp edges and on high aspect-ratio parts.

Claims

1. A biocompatible device comprising:

a device for implantation in living tissue;

a thin film of ultra-nanocrystalline diamond deposited on said biocompatible device wherein said thin film forms at least a portion of a biocompatible hermetically sealed package.

2. The biocompatible device of claim 1 wherein

said biocompatible device is comprised of one or more subassemblies which are coated with ultra-nanocrystalline diamond to achieve a biocompatible hermetically sealed package.

3. The biocompatible device according to claim 1 wherein said biocompatible device comprises an electronic device.

4. The biocompatible device according to claim 3 wherein said biocompatible device comprises a magnet.

5. The biocompatible device of claim 3 wherein said biocompatible device is at least partially coated with an ultra-nanocrystalline diamond film that comprises an electrical insulator.

6. The biocompatible device of claim 3 wherein said biocompatible device is at least partially coated with an ultra-nanocrystalline diamond film that comprises an electrical conductor.

7. The biocompatible device according to claim 3 wherein said thin film is doped to provide for electrical conductivity.

8. The biocompatible device according to claim 7 wherein a thin film of ultra-nanocrystalline diamond is doped to form one or more electrodes, where one or more electrodes are an integral part of said thin film, for communicating electrical signals with living tissue.

9. The biocompatible device according to claim 7 wherein said doping is selective, forming electric conductivity in some locations and electrical insulation in other locations.

10. The biocompatible device according to claim 3 wherein an integrated circuit comprises a sensor.

11. The biocompatible device according to claim 3 wherein said integrated circuit comprises a stimulator.

12. The biocompatible device according to claim 11 wherein a stimulator comprises a retinal electrode array prosthesis.

13. The biocompatible device according to claim 1 wherein said biocompatible device comprises an electrically conducting wire.

14. The biocompatible device according to claim 13 wherein said electrically conducting wire comprises a coil.

15. The biocompatible device according to claim 1 wherein said ultra-nanocrystalline diamond coating is approximately constant in thickness over uneven portions of said device to provide a smooth coating with rounded edges.

16. The biocompatible device according to claim 1 wherein said ultra-nanocrystalline diamond coating is patterned by photolithography.

17. The biocompatible device according to claim 1 wherein said ultra-nanocrystalline diamond coating is patterned by selective seeding.

18. The biocompatible device according to claim 1 wherein said ultra-nanocrystalline diamond coating is patterned by oxygen etching.

19. The biocompatible device according to claim 1 wherein said ultra-nanocrystalline diamond forms a capacitive relationship with living tissue that is in close proximity to said biocompatible device.

20. A method of hermetically sealing an implantable biocompatible device comprising:

providing an implantable biocompatible device;

depositing a thin film coating of ultra-nanocrystalline diamond on said implantable biocompatible device forming a biocompatible, hermetic seal.

21. The method according to claim 20 wherein

said step of depositing said thin film coating includes depositing said thin film coating in a constant thickness to provide for a smooth rounded package.

22. The method according to claim 20 further comprising the step of patterning said thin film by photolithography.

23. The method according to claim 20 further comprising the step of patterning said thin film coating by selective seeding.

24. The method according to claim 20 further comprising the step of patterning said thin film coating by oxygen etching.

25. The method according to claim 20 further comprising the step of doping said thin film coating to provide for electrical connectivity.

26. The method according to claim 25 wherein said step of doping is selective, providing for electrical conductivity in some locations and electrical insulation in other locations.