Modular light emitting diode

• US 20060262533A1
• Filed: 05/18/2005
• Published: 11/23/2006
• Est. Priority Date: 05/18/2005
• Status: Abandoned Application

• Current Assignee: Para Light Electronics Co., Ltd.
• Original Assignee: Para Light Electronics Co., Ltd.
• Inventors: Lin, Ching-Yuan, Lin, Huei-Tso
• Application Number:
  US11/131,373
• Publication Number:
  US 20060262533A1
• Time in Patent Office: Days
• US Class Current: 362/249.10
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 4/10 with light sources attached to loose electric cables, e.g. Christmas tree lights
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21V 21/005 for several lighting devices in an end-to-end arrangement, i.e. light tracks
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21W 2111/02 for roads, paths or the like
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A modular light emitting diode is disclosed. The modular light emitting diode comprises a heat-sinking base, a circuit board, a LED light emitting device, and a waterproofing layer. A protrudent portion and a plurality of trenches are formed on the surface of the heat-sinking base. Waterproof connection terminals are mounted on both sides of the circuit board. The LED light emitting device is mounted on and connected to the circuit board so as to form a complete circuit. Thereafter, the circuit board on which the LED light emitting device is mounted is stacked on the heat-sinking base to allow the LED light emitting device to be mounted on the protrudent portion of the heat-sinking base. These three stacked components are locally packaged by a waterproofing layer to complete the modular light emitting diode having the advantages of good waterproofing, rapid heat sinking, and flexible assembly.

Claims

1. A modular light emitting diode, comprising:

a heat-sinking base having a protrudent portion and a plurality of first trenches on a top surface thereof;

a circuit board having a hole formed thereon and a plurality of connection terminals oppositely mounted on the circuit board to be extended inwardly into the hole for forming a plurality of contacts around the hole;

a LED light emitting device mounted in the hole of the circuit board; and

an injection-molded waterproofing layer, in which the circuit board on which the LED light emitting device is mounted is stacked on the heat-sinking base to allow the LED light emitting device to contact with the protrudent portion of the heat-sinking base directly, and the stacked heat-sinking base, circuit base, and LED light emitting device are locally packaged by the waterproofing layer to complete the modular light emitting diode.

2. The modular light emitting diode of claim 1, wherein the LED light emitting device further comprises:

at least a chip;

a first electrode having a notched cup for holding the chip;

a second electrode having an amount corresponding to that of the chip;

a metal wire for connecting the chip and the second electrode; and

a transparent layer for locally packaging the top ends of the first and second electrodes.

3. The modular light emitting diode of claim 1, further comprising a plurality of second trenches formed on the bottom of the heat-sinking base for increasing a surface area for heat sinking.

4. The modular light emitting diode of claim 1, wherein the waterproofing layer is made of polymer material or a mixture of polymer material and ceramic powder, and formed by injection molding.

5. The modular light emitting diode of claim 1, wherein the connection terminals oppositely mounted on the circuit board are waterproof.