LED Assembly with Vented Circuit Board

• US 20070086187A1
• Filed: 10/04/2006
• Published: 04/19/2007
• Est. Priority Date: 05/18/2004
• Status: Abandoned Application

• Current Assignee: Illumafinity, LLC (Ascend Innovation Management, LLC)
• Original Assignee: OnScreen Technologies, Inc.
• Inventors: Flank, Steven, Raos, Robert, Desai, Nilesh
• Application Number:
  US11/538,769
• Publication Number:
  US 20070086187A1
• Time in Patent Office: Days
• US Class Current: 362/249.10
• CPC Class Codes: G09F 13/20 with luminescent surfaces or parts luminescent compositions C09K11/00; light sources using luminescence F21K2/00
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2203/081 Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
• CPC Class Codes: H05K 2203/1178 Means for venting or for letting gases escape
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Claims

1. A circuit board LED display assembly, comprising:

a plurality of LED modules connected by a plurality of bridges disposed in an array in which adjacent bridges define air vents therebetween; and

the bridges comprising a multilayered substrate having a thermal cooling layer and a power layer therein, the thermal cooling layer being in thermal communication with the LED modules for heat dissipation and the power layer being in electrical communication with the LED modules.

2. The circuit board LED display assembly according to claim 1, wherein the multilayer substrate includes an outer insulating layer having a plurality of openings configured for fluid communication with the thermal cooling layer.

3. The circuit board LED display assembly according to claim 1, wherein the LED modules have a base member disposed on the multilayer substrate and the base member is in thermal communication with the thermal cooling layer.

4. The circuit board LED display assembly according to claim 3, wherein the base member includes at least one extension member abutting the thermal cooling layer for thermal communication.

5. The circuit board LED display assembly according to claim 1, wherein the LED modules include a plurality of LEDs and at least one decoder unit for controlling the LEDs.

6. The circuit board LED display assembly according to claim 1, wherein the LED modules include a dome for enclosing the plurality of LEDs therein and a base member for connecting to the thermal cooling layer.

7. The circuit board LED display assembly according to claim 6, wherein the base member includes at least one extension member connecting to the thermal cooling layer.

8. The circuit board LED display assembly according to claim 1, wherein the power layer further comprises a plurality of different power layers each being separated by an insulator layer;

one of said different power layers including a plurality of X-direction electrical conductors and another of said different power layers including a plurality of the Y-direction electrical conductors.