Radio frequency device

• US 20070131781A1
• Filed: 12/08/2005
• Published: 06/14/2007
• Est. Priority Date: 12/08/2005
• Status: Abandoned Application

• Current Assignee: Kennedy Group (Ivan Bloom & Associates)
• Original Assignee: NCR Corporation
• Inventors: Keeton, Mark, Roth, Joseph
• Application Number:
  US11/297,705
• Publication Number:
  US 20070131781A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10689 : Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/1311 : Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/321 : by conductive adhesives

Abstract

A wireless radio frequency device includes: a substrate; a conductive adhesive adhered to the substrate; and an integrated circuit coupled to the conductive adhesive. The conductive adhesive is configured to function as an antenna. This allows the integrated circuit to receive and transmit radio frequency signals via the conductive adhesive.

Claims

1. A wireless radio frequency device comprising:

a substrate;

a conductive adhesive adhered to the substrate and configured to function as an antenna; and

an integrated circuit coupled to the conductive adhesive and operable to receive and transmit radio frequency signals via the conductive adhesive.

2. The wireless radio frequency device of claim 1, further comprising a liner, wherein the conductive adhesive adheres the liner to the substrate.

3. The wireless radio frequency device of claim 2, wherein the liner is releasably adhered to the substrate.

4. The wireless radio frequency device of claim 1, wherein the conductive adhesive is pressure sensitive adhesive.

5. The wireless radio frequency device of claim 4, wherein the pressure sensitive adhesive enables the radio frequency device to be adhered to an article of commerce.

6. The wireless radio frequency device of claim 4, further comprising a second adhesive which permanently adheres the integrated circuit to the substrate.

7. The wireless radio frequency device of claim 1, wherein the substrate comprises a facestock sheet having a printable side and back side, wherein the conductive adhesive and the integrated circuit are mounted on the back side of the facestock sheet.

8. The wireless radio frequency device of claim 1, wherein the conductive adhesive adheres the integrated circuit to the substrate.

9. The wireless radio frequency device of claim 1, wherein in the conductive adhesive is an acrylic based adhesive.

10. The wireless radio frequency device of claim 1, wherein in the conductive adhesive is an epoxy based adhesive.

11. The wireless radio frequency device of claim 1, wherein in the conductive adhesive is a wax based adhesive.

12. A method for producing a wireless radio frequency device, the method comprising:

applying a conductive adhesive in the configuration of an antenna to a substrate; and

connecting a integrated circuit to the conductive adhesive such that the integrated circuit is operable to receive and transmit radio frequency signals via the conductive adhesive.

13. The method of claim 12, further comprising applying a liner to the conductive adhesive.

14. The method of clam 12, further comprising tuning the wireless radio frequency device by applying the conductive adhesive in a predetermined configuration.

15. A method of processing a radio signal, the method comprising:

receiving a radio signal via conductive adhesive if the form of an antenna;

generating a response to the radio signal; and

transmitting the response to the radio signal via the conductive adhesive.