Cooling system for electronic components

• US 20070133171A1
• Filed: 12/08/2005
• Published: 06/14/2007
• Est. Priority Date: 12/08/2005
• Status: Abandoned Application

• Current Assignee: Kioan Cheon
• Original Assignee: Kioan Cheon
• Inventors: Cheon, Kioan
• Application Number:
  US11/297,997
• Publication Number:
  US 20070133171A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

Electrical components that generate heat are housed within the body (18) of a housing (12). The housing body (18) is preferably a one-piece extrusion closed at its ends by end walls (20, 22). An inlet fitting (40) in end wall (20) communicates with an adjacent end of passageway section (34). The adjacent end of passageway section (36) communicates with an outlet fitting (42). In use, a body of a cooling fluid is placed inside of the housing (12) in contact with the electronic components in the housing (12) that generate heat. A second cooling fluid is introduced into the inlet (40) and caused to flow through first the passageway section (34), then through a passageway section in end wall (22), then through the passageway section (36) in sidewall (28), and then out through the outlet fitting (42). This circulating cooling fluid removes heat from the housing (12) and the cooling fluid inside of the housing (12).

Claims

1. A cooling system for an electronic device, comprising:

a housing defining an interior space;

at least one heat producing electronic component mounted in said interior space;

said housing comprising sidewalls and end walls, and a coolant passageway extending from an inlet in one end wall, through a sidewall to the second end wall, through the second end wall to a second sidewall, and through the second sidewall back to an outlet in the first end wall;

a cooling liquid in the interior space in contact with the heat producing electronic component; and

a cooling fluid in the coolant passageway;

wherein said cooling liquid is adapted to remove heat from the heat producing electronic component inside the housing, and said cooling fluid is adapted to remove heat from the housing and from the cooling liquid in the interior space.

2. The cooling system of claim 1, wherein the housing has four sidewalls comprising spaced apart first and second sidewalls and spaced apart third and forth sidewalls that extend between and interconnect the first and second sidewalls, said sidewalls forming end openings at the opposite ends of the housing.

3. The cooling system of claim 2, wherein the end walls extend over and cover the end openings and are connected to the sidewalls.

4. The cooling system of claim 3, wherein the inlet is at one end of the first end wall and the coolant passageway includes a first section that extends lengthwise through the first sidewall, a second section that extends lengthwise through the second end wall, and a third section that extends lengthwise through the second sidewall, wherein the inlet communicates with the first section of the coolant passageway, and said first section of said coolant passageway communicates with the second section of the coolant passageway, and said second section of the coolant passageway communicates with the third section of the coolant passageway, and said third section of the coolant passageway communicates with the outlet.

5. The system of claim 1, wherein the four sidewalls are portions of an extrusion and the end walls are separate members connected to opposite end portions of the extrusion.

6. The cooling system of claim 5, comprising a gasket positioned between each end wall and its end of the extrusion.

7. The cooling system of claim 1, wherein the cooling fluid in the interior space is a liquid.

8. The cooling system of claim 2, wherein the cooling fluid in the interior space is a liquid.

9. The cooling system of claim 3, wherein the cooling fluid in the interior space is a liquid.

10. The cooling system of claim 4, wherein the cooling fluid in the interior space is a liquid.

11. The cooling system of claim 5, wherein the cooling fluid in the interior space is a liquid.

12. The cooling system of claim 6, wherein the cooling fluid in the interior space is a liquid.

13. The cooling system of claim 7, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

14. The cooling system of claim 8, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

15. The cooling system of claim 9, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

16. The cooling system of claim 10, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

17. The cooling system of claim 11, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

18. The cooling system of claim 12, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid, wherein expansion of the liquid cooling fluid in the interior space will contract the balloon and compress the compressible fluid in the balloon.

19. The cooling system of claim 1, wherein the cooling fluid in the interior space a fluorocarbon.

20. The cooling system of claim 19, comprising a balloon extending into the cooling liquid in the interior space, said balloon containing a compressible fluid.

21. A cooling system for an electronic device, comprising:

a housing defining an interior space;

at least one heat-producing electronic component mounted in said interior said space;

a cooling fluid in the interior space in contact with the heat-producing electronic component;

a coolant passageway in the housing having an inlet and an outlet; and

a cooling fluid in the coolant passageway;

wherein said cooling liquid is adapted to remove heat from the heat-producing electronic component inside the housing, and said cooling fluid is adapted to remove heat from the cooling liquid in the interspace.

22. The cooling system of claim 21, wherein the coolant passageway is a coil structure inside of the housing, and the inlet extends through a wall of the housing and connects to the coil and the outlet connects to the coil and extends outwardly through a wall of the housing.