Methods and apparatuses for sensing temperature of multi-via heater chips

• US 20070153044A1
• Filed: 12/30/2005
• Published: 07/05/2007
• Est. Priority Date: 12/30/2005
• Status: Active Grant

• Current Assignee: Slingshot Printing LLC
• Original Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Inventors: King, David, Hall, Eric, Gibson, Bruce, Parish, George, Barkley, Lucas
• Granted Patent: US 7,594,708 B2
• Time in Patent Office: Days
• US Class Current: 347/17
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/0458 controlling heads based on heating elements forming bubbles
• CPC Class Codes: B41J 2/195 for monitoring ink quality

Abstract

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Claims

1. A chip for use with a printing device, comprising:

a first heater array, positioned substantially adjacent a first via;

a second heater array, positioned substantially adjacent a second via;

a region, positioned between the first heater array and the second heater array; and

a temperature sensing element operable to sense the temperature of the region, wherein the temperature sensing element is substantially centrally disposed with respect to the region.

2. The chip of claim 1, wherein the temperature sensing element comprises a temperature sensing resistor.

3. The chip of claim 2, wherein the temperature sensing element comprises a thermal sense resistor.

4. The chip of claim 3, wherein the temperature sensing element comprises an n-type implant donor thermal sensing resistor.

5. The chip of claim 1, wherein the temperature sensing element is positioned at least 300 microns from each of the first heater array and the second heater array.

6. The chip of claim 5, wherein the temperature sensing element is positioned substantially planar to each of the first heater array and the second heater array.

7. The chip of claim 1, further comprising at least one control element operable to receive a temperature measured by the temperature sensing element.

8. The chip of claim 1, further comprising:

a third heater array, positioned substantially adjacent the second via;

a fourth heater array, positioned substantially adjacent a third via;

a second region, positioned between the third heater array and the fourth heater array; and

a second temperature sensing element operable to sense the temperature of the second region, wherein the temperature sensing element is substantially centrally disposed with respect to the second region.

9. The method of claim 8, wherein the temperature sensing element positioned between the first heater array and the second heater array is different than the second temperature sensing element positioned between the third heater array and the fourth heater array.

10. A method of fabricating chips for use with a printing device, comprising:

providing a first heater array, positioned substantially adjacent a first via;

providing a second heater array, positioned substantially adjacent a second via; and

positioning a temperature sensing element in a region between the first heater array and the second heater array, wherein the temperature sensing element is operable to sense the temperature of the region.

11. The method of claim 10, wherein positioning a temperature sensing element in the region comprises positioning a temperature sensing element in substantially the center of the region.

12. The method of claim 10, wherein positioning a temperature sensing element in the region comprises positioning a temperature sensing resistor in the region.

13. The method of claim 12, wherein positioning a temperature sensing element in the region comprises positioning a thermal sense resistor in the region.

14. The method of claim 13, wherein positioning a temperature sensing element in the region comprises positioning an n-type implant donor thermal sensing resistor in the region.

15. The method of claim 10, wherein positioning a temperature sensing element in the region between the first heater array and the second heater array comprises positioning the temperature sensing element at least 300 microns from each of the first heater array and the second heater array.

16. The method of claim 15, wherein positioning a temperature sensing element in the region between the first heater array and the second heater array comprises positioning the temperature sensing element substantially planar to each of the first heater array and the second heater array.

17. The method of claim 10, further comprising providing at least one control element operable to receive a temperature measured by the temperature sensing element.

18. The method of claim 17, further comprising:

providing a third heater array substantially adjacent the second via;

providing a fourth heater array substantially adjacent a third via; and

positioning a second temperature sensing element in a second region located between the third heater array and the fourth heater array, wherein the temperature sensing element is operable to sense the temperature of the second region, and wherein the temperature sensing element is substantially centrally disposed with respect to the second region.

19. The method of claim 18, wherein the temperature sensing element positioned between the first heater array and the second heater array is different than the second temperature sensing element positioned between the third heater array and the fourth heater array.