Verification of Performance Attributes of Packaged Integrated Circuits

• US 20070164729A1
• Filed: 01/16/2007
• Published: 07/19/2007
• Est. Priority Date: 01/16/2006
• Status: Abandoned Application

• Current Assignee: Ingenia Holdings Limited
• Original Assignee: Ingenia Holdings Limited
• Inventors: Buchanan, James, Cowburn, Russell
• Application Number:
  US11/623,633
• Publication Number:
  US 20070164729A1
• Time in Patent Office: Days
• US Class Current: 324/759.20
• CPC Class Codes: G01R 31/2896 Testing of IC packages; Test features related to IC packages containers per se H01L23/02, encapsulations per se H01L23/28
• CPC Class Codes: G01R 31/31718 Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis mechanical aspects G01R31/2808, G01R31/2851
• CPC Class Codes: G01R 31/31719 Security aspects, e.g. preventing unauthorised access during test
• CPC Class Codes: H01L 2223/54406 comprising alphanumeric information
• CPC Class Codes: H01L 2223/54413 comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 23/573 using passive means
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Packaged integrated circuits (ICs) of some types, such as processors, are graded and sold according to a performance scale, such as maximum specified clock speed, set by the manufacturer as a result of testing. As a record of this grading some part of the package, usually the upper surface, is marked with the specified performance attribute. However, criminal activity has developed where the packaging is relabelled to show a higher specification so the ICs can be fraudulently resold at a higher price. To address this problem, the invention envisages that manufacturers maintaining a product database for each packaged IC which logs not only the performance specification, but also a digital signature derived from a speckle pattern obtained from the packaging. Subsequently, any packaged IC can be rescanned to interrogate its speckle pattern and recompute the signature. The signature is then used to find the product in the database, whereby the originally specified performance attribute is retrieved. The fraud is then detectable. This method can be used to test products returned under a warranty claim, for example.

Claims

1. A method for creating a product database for storing a record for each of a plurality of products, the products being packaged integrated circuits, the method comprising:

providing an integrated circuit that has been attached to a package;

providing a performance attribute for the integrated circuit that has been determined from testing of the integrated circuit;

exposing a surface portion of the packaged integrated circuit to coherent radiation;

collecting a set of data points that measure scatter of the coherent radiation from the surface portion;

determining a signature from the set of data points; and

augmenting the product database by storing the signature from the package together with the performance attribute in the record for that product.

2. The method of claim 1, wherein the performance attribute is clock speed.

3. The method of claim 1, wherein the surface portion is made of a ceramic material.

4. The method of claim 1, wherein the surface portion is made of a metal.

5. The method of claim 1, wherein the surface portion is made of a plastics compound.

6. The method of claim 1, wherein the surface portion is made of an epoxy compound.

7. The method of claim 1, wherein the testing of the integrated circuit used to determine the performance attribute is carried out at least in part prior to packaging the integrated circuit.

8. The method of claim 1, wherein said exposing and collecting is performed by conveying successive packaged integrated circuits past a beam of the coherent radiation.

9. A method of determining a performance attribute of an integrated circuit ascribed to it at the time of manufacture as a result of testing, comprising:

exposing a surface portion of the packaged integrated circuit to coherent radiation;

collecting a set of data points that measure scatter of the coherent radiation from the surface portion;

determining a signature from the set of data points;

accessing a product database comprising a plurality of records of packaged integrated circuits, each record containing a signature obtained from a corresponding surface portion of the packaged integrated circuit at the time of manufacture together with the performance attribute;

locating in the database a record for the packaged integrated circuit to be verified based on comparison between the determined signature and the signatures stored in the product database; and

outputting the performance attribute of the packaged integrated circuit to be verified.

10. The method of claim 9, further comprising:

inputting the performance attribute of the packaged integrated circuit as shown by readable marks on the packaged integrated circuit; and

determining if the performance attribute indicated by the readable marks is the same as the performance attribute according to the product database as a test of whether the readable marks are forgeries.

11. The method of claim 10, wherein the readable marks are machine readable marks.

12. The method of claim 10, wherein the readable marks are human readable marks.