Thermosetting resin composition and its article

  • US 20070191555A1
  • Filed: 03/30/2004
  • Published: 08/16/2007
  • Est. Priority Date: 03/30/2004
  • Status: Abandoned Application
First Claim
Patent Images

1. A thermosetting resin composition comprising an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20):

  • embedded image wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.

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