Stacked semiconductor device
First Claim
Patent Images
1. A stacked semiconductor device, comprising:
- a circuit base having an element mounting part;
a first semiconductor element bonded on the element mounting part of the circuit base; and
a second semiconductor element bonded on the first semiconductor element via an adhesive layer with a thickness of 50 μ
m or more,wherein the adhesive layer is formed of an insulating resin layer whose glass transition temperature is 135°
C. or higher and whose coefficient of linear expansion at a temperature equal to or lower than the glass transition temperature is 100 ppm or less.
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Abstract
A stacked semiconductor device includes a first semiconductor element bonded on a circuit base. The first semiconductor element is electrically connected to a connection part of the circuit base via a first bonding wire. A second semiconductor element is bonded on the first semiconductor element via a second adhesive layer with a thickness of 50 μm or more. The second adhesive layer is formed of an insulating resin layer whose glass transition temperature is 135° C. or higher and whose coefficient of linear expansion at a temperature equal to or lower than the glass transition temperature is 100 ppm or less.
25 Citations
16 Claims
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1. A stacked semiconductor device, comprising:
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a circuit base having an element mounting part; a first semiconductor element bonded on the element mounting part of the circuit base; and a second semiconductor element bonded on the first semiconductor element via an adhesive layer with a thickness of 50 μ
m or more,wherein the adhesive layer is formed of an insulating resin layer whose glass transition temperature is 135°
C. or higher and whose coefficient of linear expansion at a temperature equal to or lower than the glass transition temperature is 100 ppm or less. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A stacked semiconductor device, comprising:
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a circuit base having an element mounting part and a connection part; a first semiconductor element bonded on the element mounting part of the circuit base and having an electrode part; a second semiconductor element bonded on the first semiconductor element via an adhesive layer with a thickness of 50 μ
m or more and having an electrode part;a first bonding wire which electrically connects the connection part of the circuit base and the electrode part of the first semiconductor element to each other and whose end portion connected to the first semiconductor element is buried in the adhesive layer; and a second bonding wire electrically connecting the connection part of the circuit base and the electrode part of the second semiconductor element to each other, wherein the adhesive layer is formed of an insulating resin layer whose glass transition temperature is 135°
C. or higher and whose coefficient of linear expansion at a temperature equal to or lower than the glass transition temperature is 100 ppm or less. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification