Conductive antenna structure and method for making the same

• US 20070241966A1
• Filed: 04/14/2006
• Published: 10/18/2007
• Est. Priority Date: 04/14/2006
• Status: Abandoned Application

• Current Assignee: Yung-Shun Chen
• Original Assignee: Yung-Shun Chen
• Inventors: Chen, Yung-Shun
• Application Number:
  US11/403,887
• Publication Number:
  US 20070241966A1
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/097 Corona discharge
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern

Abstract

A conductive antenna structure and method for making the same, wherein the method includes the following steps: (a) providing a plastic film substrate: (b) performing a rinsing coating material printing process to let the rinsing coating material position on the plastic film substrate and appear a predetermined antenna pattern; (c) performing an evaporating process for the plastic film substrate to provide a conductive layer thereon; (d) performing a rinsing process for the plastic film substrate to separate the rinsing coating material from the plastic film substrate and let the conductive layer position on the antenna pattern. Therefore, the conductive antenna structure made by the use of the above-mentioned method includes a plastic film substrate made of Polyethylene Terephthalate (PET) as well as a conductive antenna that is made of conductive material and is connected to the surface of the plastic film substrate, and has a predetermined first thickness.

Claims

1. A method for making the conductive antenna comprising the following steps:

(a) providing a plastic film substrate;

(b) performing a rinsing coating material printing process to let the rinsing coating material position on the plastic film substrate and appear a predetermined antenna pattern;

(c) performing evaporating process for the plastic film substrate to provide a conductive layer thereon;

(d) performing a rinsing process for the plastic film substrate to separate the rinsing coating material from the plastic film substrate and let the conductive layer position on the antenna pattern.

2. The method for making the conductive antenna as claimed in claim 1, wherein the process after the step (a) further includes a step (a1) to perform a photogravure imposing process.

3. The method for making the conductive antenna as claimed in claim 1, wherein the process after the step (b) further includes a step (b1) to perform a drying process for the plastic film substrate to remove the solvent'"'"'s water content of both of the rinsing coating material and the plastic film substrate;

in the meantime to make the plastic film substrate form a scroll.

4. The method for making the conductive antenna as claimed in claim 1, wherein the method after the step (b) further includes a step (b2) to perform a corona process to generate polarization on the surface of the plastic film substrate and the rinsing coating material.

5. The method for making the conductive antenna as claimed in claim 1, wherein the method after the step (d) further includes a step (d1) to perform a drying process to remove the solvent'"'"'s water content for the conductive layer and the plastic film substrate, afterward the plastic film substrate forms a scroll.

6. The method for making the conductive antenna as claimed in claim 1, wherein the conductive layer in step (c) is made of copper.

7. The method for making the conductive antenna as claimed in claim 1, wherein the conductive layer in step (c) is made of aluminum.

8. A conductive antenna structure comprising:

a plastic film substrate made of Polyethylene Terephthalate (PET); and

a conductive antenna being made of conductive material, connected to the surface of the plastic film substrate, and having a predetermined first thickness.

9. The conductive antenna structure as claimed in claim 8, wherein the plastic film substrate has a second thickness, and the second thickness is anywhere between 6 micro-meter 188 micro-meter (6 μ

m˜

188 μ

m).

10. The conductive antenna structure as claimed in claim 8, wherein the plastic film substrate has a first thickness that is more than 0.1 micro-meter (0.1 μ

m).

11. An apparatus for making conductive antenna structure comprising:

a photogravure coater being capable of receiving a plastic film substrate and forming into a printed substrate therefrom, and the printed substrate has a rinsing coating material positioned on the plastic film substrate and appears a predetermined antenna pattern;

an evaporator for receiving the printed substrate and evaporating a conductive layer on the printed substrate; and

a rinsing machine for receiving the printed substrate that has a conductive layer evaporating thereon, and forming the printed substrate into a rinsing substrate that is capable of removing, from the rinsing substrate, the rinsing coating material and the conductive layer provided on the rinsing coating material.

12. The apparatus for making conductive antenna structure as claimed in claim 11 further comprising at least a dryer that is capable of receiving the printed substrate and removing the solvent'"'"'s liquid content on the printed substrate.

13. The apparatus for making conductive antenna structure as claimed in claim 11 further comprising at least a dryer that is capable of receiving the rinsing substrate and removing the solvent'"'"'s liquid content on the rinsing substrate.

14. The apparatus for making conductive antenna structure as claimed in claim 11, wherein the plastic film substrate is made of Polyethylene Terephthalate (PET).

15. The apparatus for making conductive antenna structure as claimed in claim 11, wherein the plastic film substrate has a second thickness, and the second thickness is anywhere between 6 micro-meter˜

188 micro-meter (6 μ

m˜

188 μ

m).

16. The apparatus for making conductive antenna structure as claimed in claim 11, wherein the plastic film substrate has a first thickness, and the first thickness is more than 0.1 micro-meter (0.1 μ

m).