IMPRINT CIRCUIT PATTERNING
First Claim
Patent Images
1. A method for fabricating an imprinted substrate, the method comprising:
- providing a substrate;
imprinting the substrate by applying a tool to the substrate in the presence of at least one of heat and pressure to form an imprinted substrate;
depositing at least a first material substantially uniformly on at least a first portion of the imprinted substrate; and
depositing at least a second material substantially non-uniformly on at least a second portion of the imprinted substrate.
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Abstract
An imprint circuit patterning technique that shrinks the minimum feature dimension of circuit features formed on plastic substrates is provided. The imprint circuit patterning technique may be applied to the fabrication of LCDs, particularly LCDs including integral touch sensing. Substrates having patterned substantially transparent electrodes for use with such touch-sensing LCDs and the touch-sensing LCDs are also provided.
114 Citations
28 Claims
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1. A method for fabricating an imprinted substrate, the method comprising:
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providing a substrate; imprinting the substrate by applying a tool to the substrate in the presence of at least one of heat and pressure to form an imprinted substrate; depositing at least a first material substantially uniformly on at least a first portion of the imprinted substrate; and depositing at least a second material substantially non-uniformly on at least a second portion of the imprinted substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A touch screen comprising:
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a substantially transparent substrate having a plurality of imprinted features; and a plurality of electrically isolated, substantially transparent electrodes formed by substantially uniformly depositing a substantially electrically conductive material on the plurality of imprinted features. - View Dependent Claims (21, 22, 23)
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24. A method of fabricating a touch screen comprising:
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providing a substantially transparent substrate; imprinting the substantially transparent substrate by applying a tool to the substrate in the presence of at least one of heat and pressure; forming a plurality of electrically isolated, substantially transparent electrodes by substantially uniformly depositing ITO on imprinted features of the substantially transparent imprinted substrate; and forming a plurality of conductive traces by substantially non-uniformly depositing one or more materials on the imprinted substrate. - View Dependent Claims (25, 26, 27, 28)
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Specification