Semiconductor devices, assemblies and constructions, and methods of forming semiconductor devices, assemblies and constructions

  • US 20080048298A1
  • Filed: 08/28/2006
  • Published: 02/28/2008
  • Est. Priority Date: 08/28/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming semiconductor devices, comprising:

  • forming a pair of openings into a semiconductor material, the openings being spaced from one another by a segment of the semiconductor material;

    forming liners along sidewalls of the openings; and

    isotropically etching semiconductor material from the bottoms of the lined openings to merge the openings and thereby completely undercut said segment.

View all claims

    Thank you for your feedback