METHOD OF FORMING METAL PATTERN, AND METAL SALT MIXTURE

• US 20080178761A1
• Filed: 01/22/2008
• Published: 07/31/2008
• Est. Priority Date: 01/26/2007
• Status: Abandoned Application

• Current Assignee: Konica Minolta Holdings Incorporated (Konica Minolta Inc.)
• Original Assignee: Konica Minolta Holdings Incorporated (Konica Minolta Inc.)
• Inventors: TOMOTAKE, Atsushi, IIJIMA, Hirotaka
• Application Number:
  US12/017,411
• Publication Number:
  US 20080178761A1
• Time in Patent Office: Days
• US Class Current: 106/1.26
• CPC Class Codes: C23C 18/06 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: C23C 18/161 from plating step, e.g. inkjet
• CPC Class Codes: C23C 18/1692 Heat-treatment
• CPC Class Codes: C23C 18/2006 by other methods than those of C23C18/22 - C23C18/30
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C23C 18/34 using reducing agents
• CPC Class Codes: C23C 18/40 using reducing agents
• CPC Class Codes: C23C 18/44 using reducing agents
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/121 Metallo-organic compounds
• CPC Class Codes: H05K 2203/125 Inorganic compounds, e.g. silver salt
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Abstract

An objective is to provide plate making printing exhibit conductivity and flexibility with respect to a flexible substrate, and to provide a method of forming metal patterns via non-plate making printing, and a metal salt mixture usable for the method. Also disclosed is a method of forming a metal pattern possessing the steps of conducting patterning on a substrate with a metal salt mixture for the metal pattern formation possessing a metal salt and a reducing agent, and having a viscosity of 3-50 mPa·s at 25 ° C., and forming the metal pattern via heating to a temperature of 80-400° C.

Claims

1. A method of forming a metal pattern comprising the steps of:

(a) conducting patterning on a substrate with a metal salt mixture for the metal pattern formation comprising a metal salt and a reducing agent, and having a viscosity of 3-50 mPa·

s at 25°

C.; and

(b) forming the metal pattern via heating.

2. The method of claim 1,

wherein the metal salt mixture further comprises a solvent.

3. The method of claim 1,

wherein the metal is gold, silver, copper, platinum, palladium or nickel.

4. The method of claim 3,

wherein the metal is copper.

5. The method of claim 1,

wherein no physical development nucleus is substantially contained in the metal salt mixture and on a substrate.

6. The method of claim 1,

wherein the metal salt mixture has a viscosity of 3.5-40 mPa·

s at 25°

C.

7. The method of claim 6, wherein the metal salt mixture has a viscosity of 4-30 mPa·

s at 25°

C.

8. The method of claim 1,

wherein the metal salt mixture has a surface tension of 20-60 mN/m.

9. The method of claim 8, wherein the metal salt mixture has a surface tension of 25-50 mN/m.

10. The method of claim 1, wherein the metal salt mixture comprises water.

11. The method of claim 2,

wherein the metal salt mixture comprises a water-soluble organic solvent as the solvent.

12. The method of claim 2, wherein the metal salt mixture comprises a water-insoluble organic solvent as the solvent.

13. The method of claim 1, wherein the substrate is flexible.

14. The method of claim 1, wherein the metal pattern has a line width of 10-200 μ

m.

15. The method of claim 1,

wherein the heating temperature is 80-800°

C.

16. A metal salt mixture for metal pattern formation,

wherein the metal salt mixture comprising a metal salt and a reducing agent has a viscosity of 3-50 mPa·

s at 25°

C.

17. The metal salt mixture of claim 16, further comprising a solvent.

18. The metal salt mixture of claim 16,

wherein the metal is gold, silver, copper, platinum, palladium or nickel.

19. The metal salt mixture of claim 18, wherein the metal is copper.

20. The metal salt mixture of claim 16, substantially comprising no physical development nucleus.

21. The metal salt mixture of claim 16, having a viscosity of 3.5-40 mPa·

s at 25°

C.

22. The metal salt mixture of claim 21, having a viscosity of 4-30 mPa·

s at 25°

C.

23. The metal salt mixture of claim 16, having a surface tension of 20-60 mN/m.

24. The metal salt of mixture of claim 23, having a surface tension of 25-50 mN/m.

25. The metal salt mixture of claim 16, comprising water.

26. The metal salt mixture of claim 17, comprising a water-soluble organic solvent as the solvent.

27. The metal salt mixture of claim 17, comprising a water-soluble organic solvent as the solvent.