Electronic and optical circuit integration through wafer bonding
First Claim
Patent Images
1. An apparatus comprising:
- an optical circuit wafer; and
an integrated circuit wafer, wherein said optical circuit wafer and said integrated circuit wafer are bonded together by a wafer bonding process.
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Abstract
One embodiment in accordance with the invention is an apparatus that can include an optical circuit wafer and an integrated circuit wafer. The optical circuit wafer and the integrated circuit wafer are bonded together by a wafer bonding process.
20 Citations
20 Claims
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1. An apparatus comprising:
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an optical circuit wafer; and an integrated circuit wafer, wherein said optical circuit wafer and said integrated circuit wafer are bonded together by a wafer bonding process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
utilizing a wafer bonding process to couple an optical circuit wafer and an integrated circuit wafer. - View Dependent Claims (13, 14, 15)
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16. A method comprising:
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preparing an optical circuit wafer for a wafer bonding process; preparing an integrated circuit wafer for said wafer bonding process; and utilizing said wafer bonding process to couple said optical circuit wafer and said integrated circuit wafer. - View Dependent Claims (17, 18, 19, 20)
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Specification